ST, Ampere Long Term SiC Power Module Collaboration
A multi-year agreement between STMicroelectronics and Renault Group on the supply of Silicon Carbide (SiC) power modules is the next step in Ampere and...
Quantum Sensors Used To Move Prosthetics
Digitizers by Spectrum Instrumentation used to detect extremely small and fast nerve signals
The artificial limb must be moved by detecting signals from the body in...
New Expanded Littelfuse NanoT IP67-Rated Tactile Switch Series
Littelfuse declared that its NanoT tactile switch product line has been expanded. With the addition of new operational force options and top- and side-actuated...
QPT Process Enable 10 Times Better Transferring Waste Heat Away From Chip
An issue facing the power electronics industry is that packaging will find it more difficult to remove waste heat from the die as transistor...
Cadence Prototyped, Taped Out First System Chiplet in the Industry
Cadence Design Systems has declared that its first Arm-based system chiplet has been developed and successfully taped out. The company describes this as a...
Tech Mahindra, USI to Promote Engineering Innovation, Develops ODC in India
In order to create Universal Scientific Industrial (Shanghai)'s first Engineering Offshore Development Center (ODC) in India, Tech Mahindra announced a partnership with USI. The...