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TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

Exclusive Content

CONTACT Open World Highlights the Shift to Live Industrial AI on the Shop Floor

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At this year’s CONTACT Open World in Bonn, the...

Panasonic Industry Europe Targets Deep Space Hardware at Space Tech Expo 2026

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When Space Tech Expo 2026 kicks off in Bremen...

Renesas Scales Up Capacitive Touch and Power Efficiency in Expanded RL78 Lineup

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Renesas is pushing its 16-bit MCU dominance further into...

DigiKey Adds 93 New Suppliers and 27,000 Stocking Products in Massive Q3 Expansion

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DigiKey announced that in Q3 2026 it expanded its...

Solid Sands and GSAS Bring Localized Compiler Qualification Support to Indian Developers

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Solid Sands is expanding its footprint in India, teaming...

Microchip Clears Major Radiation Tests with New RISC V Space Processor

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As spacecraft become increasingly autonomous, software-defined, and incredibly data-heavy,...
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U.S. CHIPS Act – SEMI Backs Tax Credits for Semiconductor Materials Suppliers

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CHIPS Act tax credit eligibility for semiconductor material suppliers could significantly strengthen U.S. semiconductor independence, attract foreign direct investment, and secure long-term leadership in...
ELECTRONICS

Siver Shaping Future of Satellite Comm, Joins DIFI Consortium

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Sivers Semiconductors has joined the Digital Intermediate Frequency (IF) Interoperability (DIFI) Consortium, an independent space industry group that seeks to improve interoperability in satellite and...
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Breakthroughs in Photonic AI Chips Propel Next-Gen Computing

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Lightmatter, a startup based in Mountain View, California, has unveiled new photonics technology aimed at enhancing AI chip performance. Their approach uses optical connections...
ELECTRONICS

Visteon EV Powertrain Opt Infineon CoolGaN, CoolSiC Devices

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Visteon EV powertrain applications using Infineon CoolGaN (Gallium Nitride) and CoolSiC (Silicon Carbide) devices will include battery junction boxes, DC-DC converters, and on-board chargers....
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Teledyne GFD’s Hydrogen Detection Innovation at Three Upcoming Events

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Teledyne Gas & Flame Detection (Teledyne GFD) is all set for three upcoming energy-related events in Europe and Asia. Visitors to the Teledyne GFD booth...
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Siemens, TSMC Further Partners on Advanced Process Nodes, packaging

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This collaboration focuses on new certifications for Siemens EDA tools, including Calibre nmDRC, nmLVS, YieldEnhancer, and PERC, for TSMC's advanced N2P and A16 processes. Siemens...
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