Flip Electronics Accelerates Growth with Todd McAtee as Global CRO
Flip Electronics, a major provider of authorized electronic components, just welcomed Todd McAtee as their new Global Chief Revenue Officer. With over 30 years in the...
World’s First Integrated DWDM Laser Debuts for AI Infra
Tower Semiconductor and Scintil Photonics have unveiled the world’s first heterogeneously integrated DWDM laser sources designed for next-generation AI infrastructure. Built using Scintil’s SHIP™...
AKM’s 1983 Hall Sensors Hit IEEE Milestone Glory
Asahi Kasei Microdevices (AKM) just earned a huge honor, as the company ints official press release states that the IEEE has named their 1983...
TryfactaConnex Inks $7.7B MoU for 1GW AI Data Center in UP
TryfactaConnex just signed a major Memorandum of Understanding (MoU) with the Uttar Pradesh government to roll out its India AI infrastructure platform. The deal,...
R&S Rollsout Enhanced Single Tester For All NTN Testing
Rohde & Schwarz has enhanced its CMX500 radio communication tester with full support for all non-terrestrial network (NTN) technologies, establishing it as a uniquely...
Renesas Unveils Safe AI Chiplets for SDV Era at ISSCC
Renesas Electronics just unveiled three breakthrough System-on-Chip (SoC) technologies for next-gen automotive multi-domain ECUs. These pack advanced AI processing and chiplet capabilities, forming the...