SEALSQ, Kaynes Seal India’s Post-Quantum Chip Future with JV
In order to create SEALKAYNESQ Ltd., a Joint Venture ("JV") in India, SEALSQ-Kaynes SemiCon established a final, binding agreement. The goal of the joint...
PCIM Asia New Delhi Concludes Uniting 550+ Leaders in Power Electronics
In India, the PCIM Asia New Delhi Conference made a spectacular debut. With over 550 participants from industry, 89% from academia, and 11% from...
New VIAVI RF Viewer Brings AR to Wireless Network Testing
VIAVI Solutions announced the integration of RF Viewer, a new Augmented Reality (AR) solution, into its OneAdvisor 800 Wireless test platform. RF Viewer enhances...
Infineon, HL Klemove MoU To Drive Innovation in SDV Architecture
A Memorandum of Understanding (MoU) has been struck by Infineon and HL Klemove to enhance their strategic partnership in automotive technologies. In order to...
Murata Pioneers Smart Mobility, Precision Sensing at CES 2026
Murata is in Booth 4399 in West Hall at the Vehicle Technology & Advanced Mobility Pavilion at CES 2026, which is taking place in Las Vegas...
VIAVI Unveils First All-in-One Hollow Core Fiber Test Solution
The first all-in-one medium and long-range bidirectional testing and certification solution for hollow core fiber (HCF) was unveiled by VIAVI Solutions. The offering implements...