Continental’s Automotive Group Sector Spin Off Expected at Auto Shanghai 2025
During Auto Shanghai 2025, Continental will demonstrate how its software-defined vehicle solutions enhance future mobility from road to cloud, as well as how it...
New Family of Microchip Power Relays for Aerospace, Defense Applications
Microchip Technology has announced the availability of its BR235 and BR235D line of 25A QPL hermetically sealed electromechanical power relays that fulfill MIL-PRF-83536 specifications...
Littelfuse New AeroSplice Transforms How Wire Splicing is Managed in A&D
Littelfuse new AeroSplice Wire-to-Wire Connecting Solution, a wire splicing technology intended to simplify and standardize wire connections in aviation and defense applications. AeroSplice streamlines...
Telesat Lightspeed LEO Network Opts R&S Spectrum, Signal Analyzer
Telesat has been using Rohde & Schwarz's advanced testing equipment to improve the service connection design of its Telesat Lightspeed LEO network. Telesat Lightspeed...
TI’s New Automotive Analog, Embedded Processing Range for Autonomous Cars
Texas Instruments (TI) has developed a new portfolio of automotive lidar, clock, and radar chips to assist automakers in transforming vehicle safety by adding...
Axiro Semiconductor Open New Fabless Semiconductor Design Center in India
Axiro Semiconductor announced the grand opening of its cutting-edge fabless semiconductor design center in Whitefield, Bengaluru. As India's first large-scale fabless semiconductor company, with...