Discover ‘Planet Navitas’ SiC, GaN Future at PCIM 2025
Visit the "Planet Navitas" booth (Hall 9, Booth #544) to discover about Navitas' aim to 'Electrify our World™' by advancing the transition from legacy...
Cadence DDR5 12.8 Gbps MRDIMM Gen2 Memory IP on TSMC N3 Process
Cadence introduced the first DDR5 12.8 Gbps MRDIMM Gen2 memory IP system based on the TSMC N3 process, addressing the requirement for increased memory...
Aumovio New Name of Continental Group’s Automotive Sector
At Auto Shanghai, Continental Group's Automotive sector unveiled its future name. Aumovio will be the name of the independent automotive manufacturer. The new company's...
MSDE, Microsoft Augments ‘AI Careers for Women’ Across India
The Ministry of Skill Development and Entrepreneurship (MSDE) and Microsoft have signed a Memorandum of Understanding (MoU) to launch AI Careers for Women. Known to...
Renesas New RA0E2 MCUs Group Compliments RA0E1 Devices
Renesas Electronics Corporation introduced the RA0E2 MCUs Group, which is based on the Arm Cortex-M23 processor. The new, cost-effective devices have incredibly low power...
Infineon’s MEMS LBS, Marelli Creates Immersive Cockpit Designs
Infineon Technologies and Marelli are collaborating to develop automotive display technology with an innovative MEMS laser beam scanning (LBS) solution. Based on Infineon's LBS technology,...