New Compact Surface-Mount Near-Infrared LEDs from ROHM
The new compact top-view surface-mount NIR LED lineup consists of six models in three package configurations, including two ultra-compact (1.0mm × 0.6mm), ultra-thin (t=0.2mm)...
ST at SEMICON Southeast Asia 2025 to Showcase Edge AI, Automation
STMicroelectronics will be exhibiting at SEMICON Southeast Asia 2025 (Booth L1901) from May 20 to 22. The booth will feature over ten exciting demos,...
UST, T-Works to Scale-Up Semiconductor ATE, Smart Factory Inks MoU
UST and T-Works brings together UST's digital, AI, and system integration skills with T-Works' prototyping infrastructure and robust startup ecosystem.
UST has inked a Memorandum...
Siemens Buys Excellicon to Strengthen EDA Capabilities
Siemens Digital Industries Software has announced the acquisition of Excellicon, a California-based Electronic Design Automation (EDA) solutions provider renowned for its cutting-edge tools in...
Advancing High-Fidelity In-Car Audio Performance
Asahi Kasei Microdevices (AKM) and Swedish digital audio company Dirac have announced a collaboration to integrate Dirac's suite of software-defined smart acoustics solutions, AudioIQ, into...
Toshiba’s New Four 650V SiC MOSFETs Flaunt 3rd Gen SiC MOSFET Chips
Toshiba Electronic Devices & Storage Corporation has introduced four 650V SiC MOSFETs, which are equipped with the company's latest 3rd generation SiC MOSFET chips...