Diode Rolls Out New High-Performance, Low FOM 650V SiC Schottky Diodes
Diodes Incorporated has expanded its silicon carbide (SiC) product line with the introduction of five high-performance, low figure-of-merit (FOM) 650V SiC Schottky diodes.
The DSCxxA065LP...
How Defacto is Solving Critical Complexity, Scalability of RISC-V SoC Designs
Defacto Technologies, a provider of EDA solutions for SoC design, has announced upgradation of SoC Compiler software to automate front-end SoC integration procedures for complex RISC-V...
Continental’s Automotive Group Sector Spin Off Expected at Auto Shanghai 2025
During Auto Shanghai 2025, Continental will demonstrate how its software-defined vehicle solutions enhance future mobility from road to cloud, as well as how it...
New Family of Microchip Power Relays for Aerospace, Defense Applications
Microchip Technology has announced the availability of its BR235 and BR235D line of 25A QPL hermetically sealed electromechanical power relays that fulfill MIL-PRF-83536 specifications...
Littelfuse New AeroSplice Transforms How Wire Splicing is Managed in A&D
Littelfuse new AeroSplice Wire-to-Wire Connecting Solution, a wire splicing technology intended to simplify and standardize wire connections in aviation and defense applications. AeroSplice streamlines...
Telesat Lightspeed LEO Network Opts R&S Spectrum, Signal Analyzer
Telesat has been using Rohde & Schwarz's advanced testing equipment to improve the service connection design of its Telesat Lightspeed LEO network. Telesat Lightspeed...