An MoU Between VIAVI, Hanyang University to Establish 6G Research
A Memorandum of Understanding to work together on AI-RAN, 5G, and 6G research at Hanyang University's Beyond-G Global Innovation Center was announced today by...
New Same Sky Encoder Family Fits Larger Motor Shaft Sizes
In order to accommodate larger motor shaft sizes ranging from 9 mm to 15.875 mm (5/8 inch), Same Sky Motion & Control Group has...
Infineon Now Enables High-Precision Torque, Angle Measurements
The XENSIV TLE4802SC16-S0000, an inductive sensor developed to improve performance in automotive chassis applications, is being introduced by Infineon Technologies. The sensor supports digital output...
ALMM-Certified, Avaada First to Introduce 720 Wp TOPCon Modules
Avaada Electro, the solar manufacturing division of Avaada Group, announced that the Ministry of New and Renewable Energy (MNRE) has formally added its state-of-the-art...
Who is Asim Akram, The New President, CEO of MultiSensor AI
In order to guide the company's strategic growth goals, MultiSensor AI announced the appointment of its new president and chief executive officer. On June...
Rochester Enables High-Volume Market Availability of Lattice FPGA Families
Lattice Semiconductor and Rochester Electronics are working together to provide a selection of Lattice field-programmable gate arrays (FPGAs) to customers across the globe through Rochester...