TSMC is pioneering next-generation high-bandwidth memory solutions by introducing custom C-HBM4E technology on its advanced N3P process node. This development promises significant power reductions and enhanced performance tailored for AI and high-performance computing demands.
The innovations were highlighted during TSMC’s recent Open Innovation Platform Ecosystem Forum in Amsterdam.
Major memory firms are aligning with TSMC‘s capabilities. Micron has selected the foundry for producing base logic dies in its HBM4E lineup, aiming for mass production in 2027, while SK hynix plans HBM4E rollout in late 2026 using TSMC’s 12nm for standard server applications and 3nm variants for high-end AI accelerators from NVIDIA and Google.
Key Highlights
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C-HBM4E on N3P Process Node: Integrates logic dies and memory controllers with voltage drop to 0.75V, achieving up to 2x power efficiency over current DRAM processes.
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Standard HBM4 Base Dies: Built on N12 node, reducing voltage from 1.1V to 0.8V for approximately 1.5x efficiency improvement.
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Industry Partnerships: Micron taps TSMC for 2027 HBM4E production; SK hynix deploys 12nm/3nm dies for servers and premium GPUs/TPUs starting H2 2026.
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Forum Reveal: Details shared at TSMC’s Amsterdam event, emphasizing custom PHY interfaces for superior signal integrity in HBM stacks.
Which companies are partnering with TSMC on HBM4E production
TSMC fabricates the base logic dies for Micron’s HBM4E, with mass production targeted for 2027. SK hynix collaborates closely, using TSMC’s 12nm process for mainstream server base dies and advancing to 3nm for premium designs aimed at NVIDIA GPUs and Google TPUs, with initial rollout planned for the second half of 2026.
Key Partnerships
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Micron: Relies on TSMC for custom HBM4E logic dies to support high-performance AI applications.
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SK hynix: Deploys TSMC’s N12 and N3 processes for HBM4E variants, enhancing efficiency in server and flagship accelerator markets.
At The Volt Post, we see these strides as pivotal for sustainable AI growth. “TSMC’s push into customized HBM logic dies not only doubles efficiency but also accelerates the shift toward energy-optimized data centers, aligning perfectly with India’s burgeoning semiconductor ambitions,” notes our editorial lead on emerging memory tech.
