With its cutting-edge co-packaged optics technology, TSMC sets a new standard in silicon photonics and is set to introduce 1.6T optical transmission in 2025. In the semiconductor industry, TSMC’s silicon photonics journey represents the waves change. The company is pushing the limits of computing performance by combining state-of-the-art packaging technologies with optical communication systems.
A new era of high-speed, low-latency data transfer is about to begin as Broadcom and NVIDIA prepare to use TSMC’s technologies. In the upcoming years, TSMC’s developments could alter worldwide computing norms as silicon photonics poises to revolutionise industries.
With Taiwan Semiconductor Manufacturing Company (TSMC) making a breakthrough, the competition to develop in silicon photonics is getting more intense. TSMC is including co-packaged optics (CPO) into its technological portfolio by utilising cutting-edge semiconductor packaging techniques.
This development puts the corporation in a position to usher in the era of 1.6-terabit (1.6T) optical transmission by the second half of 2025, with sample delivery scheduled for early 2025. The industry heavyweights NVIDIA and Broadcom are anticipated to be TSMC’s initial clients for these state-of-the-art products.
By fusing silicon photonics and sophisticated semiconductor packaging, TSMC reaches a significant milestone. Mass manufacturing is scheduled for late 2025, with early samples anticipated to be released in the first quarter.
Micro ring modulators (MRMs) were successfully produced in an experiment using TSMC’s 3nm technology.
In order to overcome the shortcomings of current interconnect systems, NVIDIA will incorporate CPO into its next generation GB300 chips. Some optical engine (OE) packing may be outsourced because to complicated procedures and low yield rates.
Silicon Photonics is a Revolutionary Technology
Direct integration of optical communication systems onto semiconductor chips is made possible by it. It promises to remove conventional computer performance limitations, especially in data centres and applications involving artificial intelligence (AI).
By fusing its expertise in silicon photonics with cutting-edge packaging methods like CoWoS (Chip-on-Wafer-on-Substrate) and SoIC (System on Integrated Chips), TSMC’s strategy supports these objectives. Higher data transfer speeds and more energy efficiency are made possible by this integration, which removes the speed limitations connected to copper interconnects.
According to reports, Broadcom has been instrumental in TSMC’s progress. TSMC has successfully tested micro ring modulators (MRMs), a crucial part of enabling CPO technology, using its cutting-edge 3nm process. These MRMs make it possible to convert electrical impulses to optical ones quickly, which greatly improves the performance of AI-specific devices and high-performance computing (HPC).
The participation of Broadcom demonstrates the reciprocal advantages of utilising TSMC’s technological expertise. The partnership enhances TSMC’s semiconductor capabilities and solidifies Broadcom’s position as a major force in optical networking.
Hurdles In Scaling Up CPO Production
Even with its advancements, TSMC still has challenges when it comes to scaling CPO manufacturing. Yields are now below ideal levels, and the process necessitates complex packaging processes. Due to these complications, TSMC may decide to contract with other cutting-edge suppliers to handle some packaging duties in order to effectively satisfy demand.
According to experts, outsourcing may entail providing third-party vendors with optical engine (OE) packaging. This calculated move would optimise production costs and guarantee on-time delivery.
