Tria Technologies, a subsidiary of Avnet, has introduced a new leap in embedded computing with the launch of its SM2S-G3E module, marking the first SMARC solution powered by Renesas’ newly released RZ/G3E microprocessor. This development is the result of a close collaboration between Tria and Renesas aimed at meeting the fast-evolving needs of design engineers and system architects worldwide.
The new module is designed for compact systems that nevertheless demand considerable processing power, robust graphics, and advanced AI features.
At the heart of the module is the Renesas RZ/G3E microprocessor, featuring up to four Arm Cortex-A55 cores operating at 1.8 GHz, a dedicated Cortex-M33 real-time core, and the Arm Ethos-U55 neural processor unit.
These components are tailored for high-performance, cost-sensitive edge computing applications and are well-equipped for machine learning and AI workloads, even in space-constrained devices.
For graphics and video, the module includes an Arm Mali-G52 GPU and a 4K-capable video processing unit, enabling demanding multimedia interfaces on small form-factor platforms.
High memory and storage options are built in, with support for up to 8GB LPDDR4 RAM with inline error correction and up to 256Gb eMMC Flash. The module offers broad connectivity, including PCIe Gen 3, USB 3.2 Gen 2, and dual Gigabit Ethernet, as well as LVDS, MIPI-DSI, and HDMI display options.
Company leaders are enthusiastic about the new technology and its potential. Daniel Denzler, Senior Director of Business Line Management for Boards and Systems at Tria, highlighted the company’s ongoing partnership with Renesas, stating that the new SM2S-G3E module will help system architects bring their ideas to market more quickly and dependably.
President Thomas Staudinger emphasized the importance of staying ahead in the rapidly changing embedded market, pointing out that being an early adopter of Renesas solutions allows Tria to minimize risks and accelerate time-to-market for customers’ most ambitious designs.
Meanwhile, Daryl Khoo, Vice President of Embedded Processing at Renesas, explained that the RZ/G3E brings “a new class of Renesas general-purpose MPUs” to the table, geared for secure edge computing and seamless cloud integration, capable of handling independent AI/ML workloads—a fast-rising requirement in today’s edge computing landscape.
