Tower Semiconductor and Scintil Photonics have unveiled the world’s first heterogeneously integrated DWDM laser sources designed for next-generation AI infrastructure. Built using Scintil’s SHIP™ (Scintil Heterogeneous Integrated Photonics) technology, this breakthrough combines Tower’s high-volume silicon photonics platform with monolithic laser integration to meet the demanding performance requirements of advanced DWDM systems.
Dense Wavelength Division Multiplexing (DWDM) lasers play a key role in enabling Co-Packaged Optics (CPO), the foundation for future AI data center architectures aiming to deliver extreme bandwidth density, ultra-low latency, and improved energy efficiency.
This translates to higher GPU utilization and better ROI for hyperscalers powering the agentic AI era.
Scintil’s SHIP™ technology has now been validated on Tower’s silicon photonics platform, resulting in LEAF Light™, the industry’s first DWDM-optimized intelligent laser source produced through this process.
Tower’s global silicon photonics manufacturing network ensures strong production capacity, resiliency, and supply continuity, making it ideal for hyperscale deployments.
Together, Tower Semiconductor and Scintil Photonics are ready to support customer evaluations for DWDM CPO programs, providing a clear roadmap from technology qualification to high-volume manufacturing.
As AI data centers continue to expand, hyperscalers are looking for networking technologies that can cut power consumption, boost utilization, and scale seamlessly with the next generation of AI models.
The industry is clearly moving toward DWDM CPO solutions, which deliver higher bandwidth density, lower energy per bit, and ultra-low latency. LEAF Light™ leads this shift as the first production-ready DWDM laser source that integrates active lasers and mature silicon photonics monolithically on a single chip through heterogeneous integration.
Leadership Comments
“The scale-up networking opportunity is about to increase significantly as these server interconnects move to multirack CPO. Scale-up networking will consume an increasing portion of AI Networking’s $200B 2030 market as the market moves towards optical architectures, reducing the constraints on beachhead and copper bandwidth limitations per GPU/XPU,” said Alan Weckel, Founder and Technology Analyst at 650 Group, LLC. “Manufacturing and foundry to vendor alignment is the key to unlocking the CPO market to ensure the reliability and volumes that Hyperscalers need to hit their AI goals.”
“Next-generation AI infrastructure demands optical interconnects that deliver more bandwidth per fiber at lower power per bit,” said Matt Crowley, Chief Executive Officer of Scintil Photonics. “DWDM co-packaged optics meets that bar. LEAF Light™ brings the DWDM laser source technology; Tower’s SiPho platform brings the manufacturing scale. With SHIP™ now validated on Tower’s production lines, customers have a path from evaluation to millions of units per month.”
“We deeply value our long-term partnership with Scintil, and are excited to bring this revolutionary monolithic DWDM laser technology to market to enable next generations of scale-up architectures,” said Dr. Ed Preisler, VP and GM of RF Business Unit at Tower Semiconductor. “Scintil’s technology complements our PH18M platform already in mass production for optical transceivers at our facilities worldwide.”
Additional information and OFC
For more detailed information on this and Scintil manufacturing roadmap, please visit Scintil at the OFC 2026 Conference in Los Angeles, March 17–19, booth# 5537.
To learn more about Tower’s advanced silicon photonics (SiPho) platform and RF & HPA technology offerings, visit Tower’s booth #2221 at the upcoming OFC 2026 conference, March 17-19, 2025.
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