Toshiba Electronic Devices & Storage Corporation has integrated Siemens’ electronic design automation (EDA) software to boost its power device and analog chip development processes. This step targets faster innovation in next-generation semiconductors with superior performance and dependability. The collaboration equips Toshiba to handle complex challenges in advanced chip architectures.?
Key EDA Features Deployed
The Japanese multinational conglomerate employs Siemens‘ Innovator3D IC suite and Calibre 3DThermal for managing thermal issues in 2.5D/3D ICs, enabling precise co-design from initial analysis to sign-off for better package optimization.?
Tools like Insight Analyzer, mPower Analog EMIR, and PowerPro Designer support early RTL power analysis, leakage reduction, and electromigration checks to elevate device reliability.?
The Solido Simulation Suite, enhanced by AI in Solido Design Environment, accelerates analog/mixed-signal verification through variation simulations and statistical insights.?
Leadership Comments
Yoshinari Ojima, Senior Manager at Toshiba’s IC Development Center Design Engineering Department, noted that the tools enhance analog-digital co-design accuracy, streamline verification, and refine workflows to uphold quality across power, analog, digital, and mixed-signal chips.?
Yukio Tsuchida, Siemens EDA Vice President for Japan, expressed enthusiasm for aiding Toshiba’s design evolution with Siemens’ precise EDA capabilities.?
