Toray Industries declared that it has developed the world’s first TORAYFAN® biaxially-oriented polypropylene (OPP) film (see note 1) with a heat resistance near to that of a kind of engineering plastics (note 2). Samples are being shipped by the company.
Even at an ambient temperature of 160°C, the release properties (note 4) and thermal dimensional stability (note 3) are excellent.
Fluorinated films are currently frequently used as a high-heat-resistant release film in IC substrate, carbon fiber-reinforced plastic prepreg, and other molding processes. Toray will continue technical development to meet customer application needs, asserted its official release.
Because OPP film is clear and resistant to moisture, manufacturers use it extensively in packaging. Because it emits little gas and releases cleanly, they also employ it as an industrial material in their processes (note 5).
OPP film needs to be able to tolerate higher temperatures since manufacturing and processing processes are becoming more varied as electronic devices and lightweight mobility materials evolve.
The new TORAYFAN stemmed from reinforcing Toray’s high-heat-resistance technology for OPP film and integrating it with a new high-heat-resistance surface technology employing a high-heat-resistance polyolefin resin.
This reduced heat distortion to about one-tenth that of standard OPP film at 160°C (Figure 1). It also lowered wettability (note 6), which should deliver excellent release properties.
This new film is uncoated and has little moisture absorption in addition to its thermal dimensional stability and releasing properties.
This makes it appropriate for demanding applications, including thermal lamination, where even slight contamination or thermal wrinkling from released components during processing are unacceptable.
Additionally, it works well in applications that are unable to tolerate moisture in the film, such as processing battery components in dry rooms or in vacuum equipment for sputtering and vapor deposition.
Notes
- Based on Toray research.
- Engineering plastics deliver excellent heat resistance, mechanical properties, and wear resistance. At minimum, these plastics generally offer a heat resistance of 100°C, a tensile strength of 50 megapascals, and a flexural modulus of 2.4 gigapascals.
- Thermal dimensional stability indicates how well a film maintains its in-plane length and width when exposed to high temperatures. Higher thermal dimensional stability suppresses shape deformation from heat, including shrinkage wrinkles, warping, and waviness.
- Release properties indicate how easily materials peel away from film surfaces after contact or lamination.
- Low outgassing shows that films release small amounts of moisture, additives, or other gas components.
- Wettability is a liquid’s tendency to adhere to and spread across film surfaces, with lower wettability enhancing release performance across more diverse materials.
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