Six New Power Modules with TI’s Integrated Magnetic Packaging Technology

With the goals of increasing efficiency, reducing EMI, and improving power density, Texas Instruments (TI) unveiled six new power modules. By using TI’s proprietary MagPack integrated magnetic packaging technology, these power modules have reduced size by up to 23% when compared to other modules. This allows designers of industrial, enterprise, and communications applications to achieve performance levels that were previously unattainable.

With an industry-leading power density of about 1A per 1mm2 of area, three of the six new devices—the TPSM82866A, TPSM82866C and TPSM82816)—are stated as industry’s  smallest 6A power modules available.

“Designers turn to power modules to save on time, complexity, size and component count, but these benefits have required a compromise on performance – until now,” said Jeff Morroni, director of power management research and development at TI’s Kilby Labs. “After nearly a decade in the making, TI’s integrated magnetic packaging technology enables power designers to meet the defining power trend that has shaped our industry – pushing more power in smaller spaces efficiently and cost-effectively.”

TI’s unique 3D package molding process

It’s all about size in power design. Power modules combine a power chip with a transformer or inductor into a single package, simplifying power designs and saving important board space. MagPack packaging technology increases the height, width, and depth of the power modules to push more power in a smaller space by utilizing TI’s unique 3D package molding process.

A proprietary, freshly developed material integrated power inductor is part of the magnetic packaging technique. Because of this, engineers may now minimize board space and system power losses, achieve best-in-class power density, and lower temperature and radiated emissions. Given that energy is the primary cost component in applications like data centers—where some experts project a 100% increase in power consumption by the end of the decade—these advantages are particularly significant in these settings.

For Further Info Read The Technical Article 

With decades of expertise, innovative technology, and a portfolio of more than 200 devices with optimized package types for any power design or application, TI’s power modules help designers push power further.

Available today on TI.com

• Preproduction quantities of TI’s new power modules with MagPack packaging technology are available for purchase now on TI.com.
• Evaluation modules are also available, starting at US$49.
• Multiple payment, currency and shipping options are available. 

For Further Info: TI.com/powermodules