Texas Instruments (TI) stated that it is collaborating with NVIDIA to develop sensing and power management technologies that will support NVIDIA’s upcoming 800V high-voltage direct current (HVDC) data center server power distribution systems.
Next-generation AI data centers that are more reliable and scalable are made possible by the new power architecture.
The power needed per data center rack is expected to rise from 100kW now to more than 1MW in the near future due to the development of AI. A 48V distribution system today would need about 450 pounds of copper to power a 1MW rack, making it practically unfeasible for a 48V system to scale power supply to meet long-term computing demands.
Leadership Comments
“A paradigm shift is happening right in front of our eyes,” said Jeffrey Morroni, director of power management research and development at Kilby Labs and a TI Fellow. “AI data centers are pushing the limits of power to previously unimaginable levels. A few years ago, we faced 48V infrastructures as the next big challenge. Today, TI’s expertise in power conversion combined with NVIDIA’s AI expertise are enabling 800V high-voltage DC architectures to support the unprecedented demand for AI computing.”
“Semiconductor power systems are an important factor in enabling high-performance AI infrastructure,” said Gabriele Gorla, VP of System Engineering of NVIDIA. ” NVIDIA is teaming with suppliers to develop an 800V high-voltage DC architecture that will efficiently support the next generation of powerful, large-scale AI data centers.”
More details
To learn more about TI technologies powering modern data centers, watch our video, “Powering data centers: from the grid to the gate.”
