Texas Instruments (TI) unveiled new integrated automotive chips that will make driving safer and more immersive experience for drivers of all price ranges. With a single chip running cutting-edge AI algorithms, TI’s AWRL6844 60GHz mmWave radar sensor enables a safer driving environment by supporting occupancy monitoring for seat belt reminder systems, child presence identification, and intrusion detection.
With the AM275x-Q1 MCUs and AM62D-Q1 processors, TI’s next-generation audio DSP core lowers the cost of high-end audio features.
When combined with TI’s most recent analog devices, such as the TAS6754-Q1 Class-D audio amplifier, engineers can benefit from a comprehensive selection of audio amplifier systems. These gadgets will be on display by TI during the 2025 Consumer Electronics Show (CES), which will take place in Las Vegas, Nevada, from January 7–10.
For more information, see ti.com/AWRL6844, ti.com/AM2754-Q1, ti.com/AM62D-Q1 and ti.com/TAS6754-Q1.
Edge AI-Enabled, Three-in-One Radar Sensor Increases Detection Accuracy
To improve the in-car experience and satisfy changing safety regulations, original equipment manufacturers (OEMs) are progressively adding more sensors to their designs.
Engineers may replace various sensor technologies, like in-seat weight mats and ultrasonic sensors, with three in-cabin sensing features using TI’s edge AI-enabled AWRL6844 60GHz mmWave radar sensor touts to reduce overall implementation costs by an average of US$20 per vehicle.
By combining four transmitters and four receivers, the 60GHz mmWave radar sensor allows OEMs to obtain high-resolution sensing data at a cost that is optimal.
This data improves decision-making accuracy and decreases processing time by feeding into application-specific AI-driven algorithms on a programmable on-chip hardware accelerator and DSP.
The following are some instances of the AWRL6844 sensor’s edge intelligence features that enhance the driving experience:
- While driving, it supports occupant detection and localization with 98% accuracy to enable seat belt reminders.
- After parking, it monitors for unattended children in the vehicle, using neural networks that detect micromovements in real time with over 90% classification accuracy. This direct sensing capability enables OEMs to meet 2025 European New Car Assessment Program (Euro NCAP) design requirements.
- When parked, it adapts to different environments through intelligent scanning, reducing false intrusion detection alerts caused by car shaking and external movement.
To learn more, read the technical article, “Reducing In-Cabin Sensing Complexity and Cost with a Single-Chip 60GHz mmWave Radar Sensor.”
Deliver Premium Automotive Audio with TI’s Complete Audio Portfolio
OEMs strive to provide quality audio while reducing system cost and design complexity as driver expectations for improved in-cabin experiences across vehicle models rise.
Through the integration of TI’s vector-based C7x DSP core, Arm cores, memory, audio networking, and a hardware security module into a single, functional safety-capable SoC, AM275x-Q1 MCUs and AM62D-Q1 processors minimize the amount of components needed for an automobile audio amplifier system.
Both conventional and edge AI-based audio methods are processed by a neural processing unit made up of the C7x core and a matrix multiply accelerator. Because of their scalability, these automotive audio SoCs enable designers to satisfy memory and performance requirements for both entry-level and high-end systems with no modification or financial outlay.
Audio engineers can now manage many features within a single core thanks to TI’s next-generation C7x DSP core, which provides more than four times the processing performance of other audio DSPs.
With capabilities like spatial audio, active noise cancellation, sound synthesis, and sophisticated vehicle networking, including Audio Video Bridging over Ethernet, AM275x-Q1 MCUs and AM62D-Q1 processors provide immersive audio within the cabin.
To further optimize their automotive audio designs, engineers can use TI’s TAS6754-Q1 audio amplifier with innovative 1L modulation technology to deliver class-leading audio performance and power consumption, with half the number of inductors compared to existing Class-D amplifiers.
The TAS67xx-Q1 family of devices, which integrates real-time load diagnostics required by OEMs, helps engineers simplify designs, decrease costs, and increase efficiency without sacrificing audio quality.
Key Comments
“Dolby’s longtime collaboration with Texas Instruments has enabled incredible audio experiences in the home, which we’re now bringing into the car,” said Andreas Ehret, senior director of Automotive Business at Dolby Laboratories. “With TI’s C7x DSP core, we can now deliver the latest Dolby Atmos capabilities more efficiently, including support for even smaller form factor audio systems so nearly all vehicles can have Dolby Atmos. Together, these products can help turn every car ride into an immersive entertainment experience.”
“Today’s drivers expect any car – entry-level to luxury, combustion to electric – to have enhanced in-cabin experiences,” said Amichai Ron, senior vice president, TI Embedded Processing. “TI continues to provide innovative technologies to enable the future of the automotive driving experience. Our edge AI-enabled radar sensors allow automakers to make vehicles safer and more responsive to the driver, while our audio systems-on-chip elevate the drive through more immersive audio. Together they create a whole new level of in-cabin experiences.”
To learn more, read the company blog, “Redefining the commute: The advanced audio technology transforming your drive.”
Texas Instruments at CES 2025
At CES 2025, TI will demonstrate how semiconductor technologies make it possible to reimagine experiences everywhere by enabling new levels of automation, intelligence, power efficiency and affordability. Demonstrations include innovations in software-defined vehicles, advanced driver-assistance systems, robotics, medical wearables, energy infrastructure and personal electronics. See ti.com/CES for more information.
- Tuesday, Jan. 7 through Friday, Jan. 10: Visit TI in the Las Vegas Convention Center North Hall, meeting room No. N116.
- Thursday, Jan. 9 at 4 p.m. Pacific Standard time: Fern Yoon will participate in “The Road Ahead: Software Defined Vehicles.”
Package, Availability and Pricing
- Preproduction quantities of the AWRL6844, AM2754-Q1, AM62D-Q1 and TAS6754-Q1 are available for purchase now on TI.com.
- Multiple payment and shipping options are available.
- Evaluation modules are available for all four devices.