Qualcomm and ST hope to support developers in gaining smooth software integration and connection for STM32 general-purpose MCUs, including software toolkits, enabling rapid and widespread adoption through ST’s global sales and distribution networks
A new strategic partnership between STMicroelectronics and Qualcomm Technologies International is being announced in order to develop edge AI-enhanced industrial and consumer IoT solutions focusing on next-generation.
Through this highly complementary partnership, ST, Qualcomm Technologies will combine the industry-leading microcontroller (MCU) ecosystem from ST with Qualcomm Technologies’ cutting-edge AI-powered wireless connection technologies, starting with Wi-Fi/Bluetooth/Thread combination system-on-a-chip (SoC).
With this partnership, Qualcomm and ST hope to support developers in gaining smooth software integration and connection for STM32 general-purpose MCUs, including software toolkits, enabling rapid and widespread adoption through ST’s global sales and distribution networks.
ST intends to launch self-contained modules with a wider market focus. These modules will make use of Qualcomm Technologies’ Wi-Fi/Bluetooth/Thread combination SoC portfolio, which can be system-level coupled with any STM32 general-purpose microcontroller.
Decreased development and time-to-market are two benefits of improved wireless connectivity that ST’s well-established software platform makes available to its developer ecosystem. It is anticipated that OEMs will have access to the first product offerings from this partnership in Q1 2025, with further distribution to come.
This marks the beginning of a partnership that will eventually see a roadmap of SoC solutions that include Wi-Fi, Bluetooth, and threading, with the goal of expanding into cellular connection for industrial Internet of things applications.
Key Comments
Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF Products Group, for STMicroelectronics said: “Wireless connectivity is key to the fast pervasion of edge AI across an ever-growing variety of use cases in enterprise, industrial and personal applications. This is why we are establishing a strategic collaboration with Qualcomm Technologies on wireless connectivity today, starting with Wi-Fi/BT/Thread combo SoC, and already considering next steps, complementing our existing multi-protocol Bluetooth Low Energy, Zigbee, Thread and sub-GHz products portfolio. We envision wireless connectivity products based on technology from Qualcomm Technologies augmenting any of our STM32 products, bringing significant value to our more than 100,000 STM32 customers globally.”
Rahul Patel, Group General Manager, Connectivity, Broadband and Networking Business Unit for Qualcomm, Inc. said: “Qualcomm Technologies’ research and development leadership has helped drive the evolution of wireless IoT, ranging from pioneering 4G/5G, to high performance Wi-Fi, to micropower connectivity solutions. Our collaboration with STMicroelectronics pairs Qualcomm’s best-in-class connectivity offerings with ST’s leading STM32 microcontroller ecosystem and will help drive a significant acceleration of feature-rich capabilities across the IoT. Together, we are setting new developer experiences for IoT applications, supporting seamless integration and optimal performance for developers and end-users alike.”
Andrew Zignani, Senior Research Director, ABI Research, commented “With the installed base of consumer, commercial and industrial connected devices expected to reach well over 80 billion units by 2028, the proliferation of high-performance wireless connectivity solutions combined with a diverse suite of microcontrollers will be fundamental in enabling this next wave of wireless IoT innovation. This collaboration between STMicroelectronics and Qualcomm is a perfect match thanks to ST’s leading microcontroller ecosystem and Qualcomm R&D leadership in wireless connectivity, and the growing availability of these combined solutions will enable companies to address this dynamic IoT market more simply, more quickly, and more cost-effectively in the years to come.”
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