This collaboration focuses on new certifications for Siemens EDA tools, including Calibre nmDRC, nmLVS, YieldEnhancer, and PERC, for TSMC’s advanced N2P and A16 processes.
Siemens Digital Industries Software and Taiwan Semiconductor Manufacturing Company (TSMC) have further strengthened their long-standing partnership to accelerate innovations in semiconductor design and integration.
This collaboration focuses on new certifications for Siemens EDA tools, including Calibre nmDRC, nmLVS, YieldEnhancer, and PERC, for TSMC’s advanced N2P and A16 processes.
The Analog FastSPICE (AFS) platform and Solido have also been validated for these nodes and are part of the official Customer Design Reference Flow (CDRF), providing customers with a comprehensive signoff flow for advanced analog, mixed-signal, and memory designs.
Driving Innovation in Advanced Process Nodes
The collaboration between Siemens and Taiwan Semiconductor Manufacturing Company has led to the certification of Siemens’ Calibre nmPlatform tool for TSMC’s N2 and N2P processes.
This includes the new Local Standard Verification Rule Format (LSVRF) functionality in Calibre, enabling independent rule checking within specific regions of a processor for optimal verification accuracy. Additionally, Siemens’ Calibre xACT™ software has been qualified for TSMC’s N2 process.
Siemens’ Analog FastSPICE platform has achieved certification for TSMC’s advanced N3P, N2, and N2P processes. As part of the custom design reference flow (CDRF) for TSMC’s N2 processes, the AFS platform now supports TSMC’s Reliability Aware Simulation technology, addressing IC aging and real-time self-heating effects.
The CDRF for TSMC’s N2 technology also includes Siemens’ Solido™ Design Environment software for advanced variation-aware verification at high sigma.
Advancements in 3D IC Design and Packaging
Siemens, Taiwan Semiconductor Manufacturing Company successfully collaborated to certify Siemens Calibre 3DSTACK solution’s support for TSMC’s latest 3Dblox standard. This certification continues the partners’ ongoing collaboration on thermal analysis requirements for TSMC’s 3DFabric advanced packaging technologies.
Siemens’ commitment to supporting the latest TSMC processes also extends to the TSMC 3DFabric technology. The company has successfully completed the design requirements for TSMC’s cutting-edge 3DFabric design flows.
As part of the qualification process, Siemens enhanced its Xpedition Package Designer (xPD) tool to support Integrated Fan-Out Wafer Level Packaging (InFO) design-rule handling with automated avoidance and correction.
Calibre 3DSTACK, DRC, and LVS are furthermore enabled and certified for the latest TSMC 3DFabric technologies, including InFO, CoWoS®, and TSMC-SoIC™.
Cloud-Based Workflows and Future Technologies
Cloud-based workflows are also coming into focus: Seven Siemens tools have been certified for production-ready signoff processes in the AWS cloud. The cooperation also extends to the development of future A14 technology, thereby strengthening the technological foundation for AI, automotive, hyperscale, and mobile applications.
Siemens’ relationship with TSMC now also extends into the services realm, with Siemens officially joining the TSMC Design Center Alliance (DCA).
As a member of this alliance, Siemens offers a broad portfolio of services with a track record of success in enabling design for Taiwan Semiconductor Manufacturing Company customers, ranging from startups to Fortune 500 companies.
Siemens services encompass crucial elements of the IC design flow, including support for place-and-route, design-for-test, functional verification, emulation, custom memory development, and IC packaging initiatives.
Leadership Comments
“Siemens is pleased to collaborate with TSMC to deliver EDA technologies that provide customers with an expanding number of design avenues, even as time, cost, and design complexity pressures continue to rise,”
“Siemens EDA tools will empower the design of more efficient and scalable semiconductor solutions as we continue our deep collaboration with TSMC.”
Dan Kochpatcharin, Head of Ecosystem and Alliance Management Division at TSMC Said:
“Strengthening our ongoing alliance with Open Innovation Platform® (OIP) ecosystem partners like Siemens keeps us at the forefront in accelerating advancements in 3D IC design for AI innovation,”
“Through our continued partnership, TSMC and Siemens are setting new standards for next-generation semiconductor technologies that will drive the future of computing.”
In addition, TSMC’s CEO, C.C. Wei, emphasized the importance of the partnership:
“Our joint work with Siemens on advanced design flows enables TSMC to stay at the cutting edge of semiconductor manufacturing. This collaboration enhances our ability to deliver exceptional value to customers and ensures TSMC’s leadership in advanced process nodes and packaging technologies.”
The deepened collaboration between Siemens and TSMC underscores their commitment to advancing semiconductor design and integration.
By achieving new certifications for Siemens EDA tools across TSMC’s advanced process nodes and packaging technologies, the partnership enables mutual customers to develop innovative and highly differentiated end-products.
The focus on cloud-based workflows and future technologies further positions both companies at the forefront of semiconductor innovation.
