Recently, SEMIFIVE and Synopsys announced their partnership to create a state-of-the-art high-performance computing (HPC) platform that combines SEMIFIVE’s CPU chiplet with an external I/O chiplet into a single, integrated package.
In comparison to conventional chiplet platforms, SEMIFIVE’s high-performance computing chiplet platform will provide significant benefits in terms of cost reduction, performance optimization, and development flexibility.
By advancing semiconductor technology, this platform will enable the development of adaptable and customized chiplets to satisfy the various demands of HPC clients.
The Synopsys UCIe controller, PHY IP, and more IP solutions will be included in SEMIFIVE‘s CPU chiplet, which is produced using 4nm manufacturing technology.
SEMIFIVE is an instrumental player in cutting-edge custom silicon solutions and has achieved numerous generations of silicon success mingled with Synopsys’ intellectual property solutions.
With SEMIFIVE’s portfolio of optimized SoC platforms, clients can increase the total efficiency of their development since they are pre-designed and proven on sophisticated process nodes.
Key Comments
“Synopsys and SEMIFIVE are helping companies adopt multi-die designs to address the growing compute demands of high-performance systems,” said Michael Posner, vice president of IP product management at Synopsys. “The combination of Synopsys’ silicon-proven UCIe IP, which has been adopted by multiple hyperscalers, and SEMIFIVE’s extensive SoC platform, helps companies reliably meet their multi-die design requirements and accelerate their development effort.”
“We are confident that chiplets represent the future of silicon design. Our collaboration with Synopsys, particularly using their UCIe IP, is a key factor in ushering in the chiplet era,” said Brandon Cho, CEO and co-founder of SEMIFIVE. “By delivering platforms like the HPC chiplet platform, we will enable our customers to bring innovative, customized solutions to market faster than ever before.”
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