The size of the global semiconductor chip packaging market would increase by USD 993.4 billion between 2024 and 2028. Throughout the forecast period, the market is anticipated to expand at a CAGR of more than 37.32%. With a tendency toward increasing investments in lower technology nodes, the market is expanding due to rising investment in fabrication facilities. High initial investment is a problem, though.
To satisfy the growing demand for semiconductors that are more compact, powerful, and energy-efficient, semiconductor manufacturers are constantly coming up with new ideas. In order to accomplish this, they are making significant R&D investments to find novel technologies for creating ICs with smaller process nodes, like FinFET and FD-SOI.
This trend is being driven by Moore’s law, which states that an integrated circuit’s transistor count will double roughly every two years. The benefits of FinFET and FD-SOI technologies in terms of performance, scalability, and power consumption are making them more and more popular. FinFET, which offers higher performance, reduced power consumption, and increased density, is frequently utilized in 14/16 nm nodes.
With its ultra-low power consumption at 0.4V operation and balanced power-performance trade-off, FD-SOI technology is utilized in 10/12 nm nodes. In response, new fabrication facilities are being constructed by the semiconductor industry to facilitate the creation of integrated circuits (ICs) based on these lower technology nodes. For example, Taiwan Semiconductor Manufacturing declared in June 2021 that it would construct a state-of-the-art semiconductor manufacturing facility in the United States. The market is anticipated to rise over the projected period because to the increase in investment in semiconductor manufacturing facilities, which would increase demand for semiconductor chip packaging made especially for semiconductor wafers.
The military’s growing reliance on cutting-edge semiconductor components for defense electronics and trends in defense sector spending are driving the semiconductor chip packaging market’s notable expansion. For densifying integrated circuits in military applications, IC packaging materials like leadframes, encapsulation resins, and thermal interface materials are highly sought after.
Furthermore, the demand for miniaturization and cutting-edge packaging solutions like Surface Mount Technology and Small Outline Packages is being driven by the consumer electronics industry, which includes laptops, smartwatches, and smartphones. The emergence of driverless vehicles and the 5G revolution are also driving industry expansion. To remain competitive, centers of electronics production are making investments in machine learning, digitalization trends, and foreign capital.
To fulfill the demands of developing technologies like artificial intelligence, the internet of things, and autonomous driving, advanced packaging technologies like System in Package, 3D packaging, and organic substrates are crucial. Nonetheless, issues including outsourcing, testing procedures, intellectual property issues, product obsolescence, and the requirement for mechanical support and electrical insulation continue to exist. For improved performance and dependability, the market is also seeing the use of encapsulating resins and sophisticated bonding wire.
Major Shifts In The Semiconductor Chip Packaging Business
The growing need for small integrated circuits (ICs) and the introduction of sophisticated packaging options such as stacked packaging, Through-Silicon Vias (TSV), and Micro-Electromechanical Systems (MEMS) packaging are causing major shifts in the semiconductor chip packaging business.
Higher manufacturing costs are a result of manufacturers making significant investments in new machinery to create these small integrated circuits.
The cost is further enhanced by the lengthy production period, the intricate manufacturing process, and the higher chance of errors. The semiconductor industry’s rapid technical improvements require the usage of efficient equipment, which raises the total cost of ownership.
As a result, a lot of businesses are switching to a fabless model, which lowers the number of possible clients for suppliers of semiconductor chip packaging. These obstacles are anticipated to impede market expansion throughout the forecast period, notwithstanding the substantial initial investment.
Consumer Electronics Demand
The market for semiconductor chip packaging is expanding significantly as a result of rising consumer electronics demand for cutting-edge devices like smartphones and tablets. The Internet of Things, sophisticated packaging, autonomous driving, artificial intelligence, and electric vehicles are some of the major industries propelling this expansion.
Miniaturization, thermal and electrical performance, as well as cutting-edge technologies like System in Package, 3D packaging, organic substrates, and sophisticated encapsulation resins, present challenges in semiconductor packaging.
Cutting-edge strategies like Flip Chip compete with conventional packaging techniques including die-attach materials, bonding wire, and ceramic packages. High-frequency applications, smart manufacturing, the telecommunications sector, and the aerospace and defense industries all support the market’s expansion.
Furthermore, sophisticated packaging solutions for power densities, thermal management, and signal integrity are needed in industries like wearable technology, automobile electronics, and automotive electronics. Regulations such as the Production Linked Incentive and the requirement for electromagnetic interference and compatibility in a variety of applications also have an effect on the market.
The growing need for more functionality, better performance, and lower costs is driving the semiconductor chip packaging market’s notable expansion. High-end memory applications, heterogeneous connections with CMOS Image Sensors (CIS), micro-electromechanical systems (MEMS), sensors, radio frequency (RF) filters, and performance applications all depend on three-dimensional interconnect (3DIC) through-silicon via (TSV) technology.
Major Players
Some of the major players in the semiconductor chip packaging market are 3M Co., Amkor Technology Inc., Applied Materials Inc., ASE Technology Holding Co. Ltd., ASMPT Ltd., ChipMOS TECHNOLOGIES INC., Foundaries Inc., Jiangsu Changdian Technology Co. Ltd., Kulicke and Soffa Industries Inc., Microchip Technology Inc., Taiwan Semiconductor Manufacturing Co. Ltd., Tokyo Electron Ltd., Unisem M Berhad, UTAC Holdings Ltd., and Veeco Instruments Inc.
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