Rohde & Schwarz and Realtek Semiconductors have successfully validated the industry’s first test solution for the upcoming Bluetooth® LE High Data Throughput (HDT) feature.
The companies will jointly showcase the setup based on the CMP180 radio communication tester from Rohde & Schwarz, characterizing Realtek’s next generation Bluetooth solution RTL8922D and RTL8773J, at MWC Barcelona 2026 as well as at embedded world 2026 in Nuremberg.
The advanced capabilities of the CMP180 from Rohde & Schwarz make it an ideal Bluetooth® test solution across R&D, pre conformance and mass production. Ready today for future Bluetooth® LE enhancements in higher?frequency bands, the CMP180 is also ideally suited for multi?technology and multi?device testing.
The Bluetooth LE High Data Throughput (HDT) feature is a cornerstone for the next generation of Bluetooth® LE. By raising the maximum data rate from 2 Mbps to 7.5 Mbps, HDT significantly enhances traditional use cases and enables new ones, including low latency audio streaming, fast media sharing and accelerated over the air software updates.
Technically the new HDT feature is characterized by up to 4x increased capacity, better energy efficiency, improved spectrum efficiency and enhanced reliability. The new Bluetooth® LE PHY will support five different data rates from 2 to 7.5 Mbps, by combining three new modulation schemes and different levels of forward error correction.
Realtek’s next generation Wi-Fi/Bluetooth Combo chip RTL8922D and Bluetooth Audio Chip RTL8773J together provide a comprehensive platform for high performance wireless and audio platform. The RTL8922D is a multi function Wi Fi and Bluetooth combo chip with HDT, channel sounding, and IEEE 802.15.4 integration, enabling simultaneous Wi Fi, dual Bluetooth and Zigbee/Thread connectivity for PCs, TVs, gaming, automotive and smart home devices.
The RTL8773J is a dedicated Bluetooth audio SoC that unifies BT Legacy, Bluetooth LE, LE Audio and HDT, delivering energy efficient, low latency audio processing for intelligent audio products and enhancing robustness, connectivity HDT enabled transmission.
The CMP180 from Rohde & Schwarz supports many cellular and non-cellular technologies including Wi-Fi 8 and 5G NR FR1 up to 8 GHz with bandwidths of up to 500 MHz. It includes Bluetooth® LE testing controlled by the Bluetooth® LE direct test mode (DTM) as well as via chipset specific test control and is ready for the new universal test protocol (UTP).
It comes with two analyzers, two generators and two sets of eight RF ports in a single box. Overall, the CMP180 is a cost-effective test solution for advanced wireless technologies that addresses current and future testing needs.
Rohde & Schwarz and Realtek Semiconductors will showcase Bluetooth® LE High Data Throughput (HDT) testing at two key industry events at the Rohde & Schwarz booths. At Mobile World Congress 2026 from March 2 to 5, 2026 at Fira Gran Via in Barcelona in hall 5, booth 5A80.
At embedded world Exhibition & Conference in Nuremberg from March 10 to 12, 2026, visitors can find it at the Rohde & Schwarz booth in hall 4, booth 218 as well as at the Realtek booth in hall 3A, booth 325.
Leadership Comments
Goce Talaganov, Vice President of Mobile Radio Testers at Rohde & Schwarz, said: “We are grateful for the close collaboration with Realtek Semiconductors on the upcoming Bluetooth® LE features to demonstrate the unique capabilities of the CMP180 over the entire product life cycle. Our experience in wireless device testing and this early cooperation with Realtek allow us to provide best-in-class test solutions for our customers.”
Yee-Wei Huang, Vice President and Spokesman at Realtek Semiconductors, said: “Bluetooth LE High Data Throughput is a key enabler for the next wave of immersive audio and seamless connectivity experiences. By combining our RTL8922D Wi Fi/Bluetooth combo chip and RTL8773J Bluetooth audio SoC with the CMP180 test platform from Rohde & Schwarz, we can help our customers bring HDT ready products to market faster, with proven performance from R&D through mass production.”
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