Renesas Electronics unveiled a brand-new, market-leading Bluetooth chip that integrates memory, peripherals, security features, an Arm® M0+ microprocessor, and a radio transceiver into a small SoC design.
The company’s Bluetooth® Low Energy system-on-chip (SoC) family’s first automotive-qualified device, the DA14533, has sophisticated power management features to streamline system integration and save power usage.
Developers may get started on projects in applications ranging from wireless sensors and battery management systems to tire pressure monitoring and keyless entry thanks to its software stack’s qualification against Bluetooth Core 5.3 and support for higher temperatures.
Optimized Design to Deliver Unparalleled Power Efficiency
Renesas’ dominance in Bluetooth LE SoCs (SmartBond Tiny Family) with industry-best low power consumption is being built upon with the new DA14533, which has some of the most cutting-edge power management capabilities available.
An inbuilt DC-DC buck converter in the device precisely modifies the output voltage in accordance with system specifications. With only 3.1mA needed for transmission and 2.5mA needed for reception, the active system power consumption is less than that of similar devices on the market.
The current decreases to 500 nA when in hibernate mode. In addition to meeting the demanding power needs of tire pressure monitoring systems’ mission profile, these power management and power-saving features let small-capacity battery-powered systems operate for longer.
Auto-Grade AEC-Q100 Qualified and Up-to-Date Security Features
The DA14533 has undergone rigorous testing to maintain quality and reliability in demanding automotive situations, making it an AEC-Q100 Grade 2 rated device.
Additionally, the device’s wide temperature range (-40 to +105°C) guarantees dependable operation under harsh circumstances, which makes it perfect for industrial and automotive applications where stability and longevity are crucial.
The device has the newest security capabilities to protect linked devices from different dangers and satisfies Bluetooth Core 5.3 requirements.
“Our SmartBond Tiny SoC family has seen remarkable success in the industrial market, with over 100 million units shipped to date,” said Chandana Pairla, VP of Connectivity Solutions Division at Renesas. “This new automotive-grade device will enable a new class of Bluetooth LE applications that demand high power efficiency, a small footprint and broader temperature tolerance for next-generation battery-powered automotive and industrial systems.”
Lower Bill-of-Materials Reduces Costs and Simplifies Development
The DA14533 has a best-in-class engineering bill of materials (eBOM) and only needs six external components, just like other Bluetooth LE SoC devices in the SmartBond Tiny family.
There is no need for a separate oscillator for sleep mode because both active and sleep modes are controlled by a single external crystal oscillator (XTAL). It is the smallest automotive Bluetooth LE SoC available on the market due to its incredibly small design, which comes in a WFFCQFN 22-pin 3.5 x 3.5 mm package.
The device’s small size and low eBOM allow it to be easily integrated into systems with limited space, which lowers system costs overall and speeds up clients’ time to market.
Key Features of the DA14533
- Arm® Cortex®-M0+ microcontroller – Standalone application processor or data pump in hosted systems
- 64KB RAM and 12KB One-Time Programmable (OTP) memory
- 2.4 GHz radio transceiver
- Integrated low IQ buck DC-DC converter
- External SPI flash
- Single XTAL operation (single crystal oscillator)
- Software stack qualified against Bluetooth Core 5.3
- AEC-Q100 Grade 2-qualified with wide operating temperature range support (-40 to +105°C)
- WFFCQFN 22-pin 3.5 x 3.5 mm package
Winning Combinations
Renesas has combined the new Bluetooth LE SoC with the R-Car H3/M3/E3 SoCs, PMICs, and timing devices to offer a wide array of Winning Combinations including “Tire Pressure Monitoring System.”
Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market.
Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found, HERE.
Availability 
The DA14533 is available today, along with the Bluetooth Low Energy SoC Development Kit Pro. The kit includes a motherboard, a daughterboard, and cables to facilitate application software development. The daughterboard is also available by itself to simplify development. A blog about the new device is available.
Further info on Renesas Bluetooth Low Energy solutions: CLICK HERE
