In order to enable precise control of via characteristics in 1.6 Tbps-class high-speed transmission PCBs that support next-generation AI data centers, the OKI Group’s PCB business company OKI Circuit Technology has successfully developed High-Accuracy Simulation Technology for High-Frequency Vias.
By utilizing this innovative technology, OKI will help reduce research and mass production startup times for clients’ high-transmission PCBs by precisely controlling via characteristics, which is essential for multilayer PCBs with increasingly greater densities and frequencies.
AI servers, data centers, and AI chips are growing in size and speed in tandem with the quick development and spread of generative AI systems. As related equipment’s PCBs have grown more physically complicated and multilayered, it has become more crucial to take steps to minimize transmission losses and signal reflections that hinder high-speed transmission.
This is particularly true for the vias, which are structural transition points that influence the high-frequency signals used for high-speed transmission and are used to electrically connect the layers within a multilayer PCB. Controlling via characteristic impedance (Note 3), which reduces signal reflection, is a crucial component of technology.
Because of these factors, extremely precise models are now essential for SI simulation in order to confirm final signal quality throughout the design phase of PCB development for high-frequency applications. However, traditional modeling techniques have difficulty adequately representing the impacts of the manufacturing process and changes of material properties in high-frequency regions when the fundamental frequency surpasses 50 GHz.
This presents a significant problem by making it challenging to get simulation findings that correlate with real characteristics (measured results).
OTC has effectively created High-Accuracy Simulation Technology for High-Frequency Vias, which takes into consideration the increasingly intricate features of high-frequency vias, in order to solve this problem.
In particular, the simulation results of the new technology are used to thoroughly assess and optimize the via structure, dimensions, and manufacturing margins in accordance with our factories’ manufacturing lines prior to PCB fabrication in order to extract the ideal conditions satisfying the signal quality requirements.
OTC created its own database of metrics, including final dimensions, production variances, and material qualities, using the evaluation data it had gathered over the years. The method guarantees dependable signal characteristics in real goods and allows for extremely accurate modeling utilizing 3D electromagnetic field analysis tools.
OTC is to exhibit at the OTC booth (No. 512) at SWTest Asia 2025, Asia’s only conference dedicated to semiconductor wafers, to be held at Hilton Fukuoka Sea Hawk from November 20 to 22, 2025.
High-speed Transmission introduction site: CLICK HERE
