Demand for power management devices that offer greater power density and streamline system design is being driven by the growing need for compact, reliable, and efficient power solutions. A new series of DualPack 3 (DP3) power modules with cutting-edge IGBT7 technology is announced by Microchip Technology.
There are six different models available at 1200V and 1700V with high-current ranging from 300 to 900A. The growing need for small, affordable, and straightforward power converter solutions is being met by the new DP3 power modules.
These modules utilize the latest IGBT7 technology, which reduces power losses by up to 15% to 20% compared to IGBT4 devices and can tolerate higher temperatures—up to 175°C—during overload.
DP3 modules are ideal for optimizing power density, reliability, and usability in industrial drives, renewable energy sources, traction, energy storage, and agricultural vehicles because they improve protection and control during high-voltage switching.
The DualPack 3 (DP3) power modules, which have a small footprint of about 152 mm × 62 mm × 20 mm and are available in a phase-leg arrangement, allow for a frame size jump for higher power output.
This kind of sophisticated power packaging helps lower system complexity and Bill of Materials (BOM) expenses by doing away with the need to parallel many modules.
Furthermore, DP3 modules give customers more supply chain security and flexibility by offering a second-source alternative to industry-standard EconoDUAL packaging.
General-purpose motor drive applications benefit greatly from the DualPack 3 power modules, which solve typical issues like dv/dt, driving complexity, increased conduction losses, and no overload capabilities.
Analog devices, Silicon (Si) and Silicon Carbide (SiC) power technologies, dsPIC® Digital Signal Controllers (DSCs), and standard, customized, and custom power modules are all part of Microchip’s extensive power management solution range.
Leadership Comments
“Our new DualPack 3 modules with IGBT7 technology can reduce design complexity and lower system costs while maintaining high performance,” said Leon Gross, corporate vice president of Microchip’s high-reliability and RF business unit. “To further streamline the design process, our power modules can be integrated as part of a comprehensive system solution alongside Microchip’s microcontrollers, microprocessors, security, connectivity and other components to accelerate development and time to market.”
For more information about Microchip’s power management products, visit the web page.
Pricing and Availability
The DualPack 3 power modules are now available in production quantities.
You can purchase directly from Microchip or contact a Microchip sales representative or authorized worldwide distributor.
