The first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs) have been supplied by Renesas Electronics Corporation, according to the company.
To meet the ever-increasing memory bandwidth requirements of High-Performance Compute (HPC), Artificial Intelligence (AI), and other data center applications, new DDR5 MRDIMMs are required.
With operating speeds of up to 12,800 Mega Transfers Per Second (MT/s), they outperform first-generation solutions in terms of memory bandwidth by a factor of 1.35.
Renesas has played a key role in the design, development, and implementation of the new MRDIMMs, working with end users and leading industry players like CPU and memory suppliers.
The RRG50120 second-generation Multiplexed Registered Clock Driver (MRCD), the RRG51020 second-generation Multiplexed Data Buffer (MDB), and the RRG53220 second-generation Power Management Integrated Circuit (PMIC) are three new crucial components that Renesas has designed and implemented.
The only memory interface provider that provides the full chipset solutions for industry-standard next-generation MRDIMMs and all other server and client DIMMs is Renesas, which also produces temperature sensor (TS) and serial presence detect (SPD) hub solutions in large quantities.
The MRDIMMs use Renesas’ RRG50120 second-generation MRCD to buffer the clocks between the host controller and DRAMs, chip selects, and the Command/Address (CA) bus. A crucial feature for heat control in extremely high-speed systems is that it uses 45% less power than the original device.
The other essential component of MRDIMMs that buffers data from the host CPU to DRAMs is the RRG51020 Gen2 MDB. Up to 12.8 gigabytes per second (GB/s) are supported by the new Renesas MRCD and MDB. Furthermore, Renesas’ RRG53220 next-generation PMIC is tuned for high-current and low-voltage operation and provides the highest electrical over-stress protection and greater power efficiency.
Availability
Renesas is sampling the RRG50120 MRCD, the RRG51020 MDB, and the RRG53220 PMIC now, and expects the new products to be available for production in the first half of 2025.
More information on these new products is available at www.renesas.com/DDR5.
Key Comments
“The demand for higher performance systems driven by AI and HPC applications is relentless,” said Davin Lee, Senior Vice President and General Manager of Analog & Connectivity and Embedded Processing. “Renesas is at the forefront of this trend, working with industry leaders to develop next-generation technology and specifications. These companies depend on Renesas to deliver the technical know-how and the production capabilities they require to meet unprecedented demand. Our latest chipset solutions for second-generation DDR5 MRDIMMs showcase our leadership in this market.”
