Not naming the new 3nm SoC, MediaTek earlier announced its partnership with TSMC. Now making the latest buzz, the MediaTek CEO has shared their fostered relationship with TSMC. It is known by the reports that MediaTek and TSMC to soon jointly launch its maiden 3nm product. The new joint announcement by MediaTek and TSMC product is buzzed to be named as Dimensity 9400.
According to vital reports MediaTek and TSMC’s new Dimensity 9400 will be a next-gen low-power chipset. The cost has still not been made official but sources say that it will be quite cost-effective. Also, the new Dimensity 9400 will be far ahead a powerful chipset when compared to its earlier Dimnesity 9300 – which is still the most accoladed smartphone chipset of MediaTek.
The Dimnesity 9300 is today opted by leading smartphone manufacturers and is been embedded in their flagship smartphones.
The new Dimensity 9400 launch can also bring some stress to its closest competitor QUALCOMM.
Comparing 2024 with 2023, MediaTek CEO Rick Tsai says in the latest report from Economic News Daily that next year will be significantly better thanks to the AI boom, and with the company offering its own chips focused on this category, it should result in a positive outcome.
He also said the company has also partnered with Intel for its 16nm nodes. However, the relation might not be on the wide-bandgap front chipset.
Inside the New Dimensity 9400
The new chipset by MediaTek and TSMC is learned to have a CPU cluster offering a Cortex-X5 and a formidable CPU design. The new chipset is designed to improve multi-core performance and offer low power which significantly has been a tussle for Dimensity 9300. TSMC and MediaTek are known to be vitally working on power generation while making a faster and more powerful multi-core functionality.
The Dimensity 9400 SoC, might also use TSMC’s ‘N3E’ process which can invariantly be better performing than Apple’s integration of A17 Pro and M3.
