IPM5 modules are expected to power key sectors such as automotive systems, consumer electronics, industrial automation, and clean energy applications.
In a historic milestone for India’s semiconductor industry, Kaynes Semicon has announced the successful rollout and shipment of the country’s first commercially manufactured Multi-Chip Module (MCM). The achievement signals a major leap toward India’s vision of becoming a global hub for advanced semiconductor packaging and testing technologies.
The company asserted that it has produced and delivered 900 units of its high-performance IPM5 Multi-Chip Module—an advanced device that integrates 17 individual dies, including Insulated Gate Bipolar Transistors (IGBTs), controller ICs, Freewheeling Diodes (FRDs), and power diodes within a single compact package.
These modules were fully assembled, tested, and quality-cleared at Kaynes Semicon’s state-of-the-art OSAT (Outsourced Semiconductor Assembly and Test) facility in Sanand, Gujarat.
Breakthrough in Domestic Semiconductor Manufacturing
The rollout of the IPM5 marks a defining moment for India’s packaging ecosystem, proving that complex, high-density semiconductor modules can be designed, assembled, and qualified domestically to international standards.
Kaynes Semicon’s collaboration with global partners—including Alpha & Omega Semiconductor from the U.S. and Japan’s Mitsui & Co., Ltd.—played a significant role in achieving this milestone by combining global supply chain expertise with advanced process technologies.
The Sanand OSAT facility currently has a production capacity of 6.3 million chips per day, with plans to begin full mass production by January 2026.
The company is targeting a capacity ramp-up to 1.5 million chips per day by the first quarter of FY 2026–27, reinforcing India’s growing proficiency in large-scale, high-quality semiconductor manufacturing.
Empowering India’s Semiconductor Vision
Beyond the production figures, this accomplishment underscores the acceleration of India’s semiconductor mission—a national initiative aimed at establishing advanced chip manufacturing, packaging, and testing infrastructure.
The IPM5 modules are expected to power key sectors such as automotive systems, consumer electronics, industrial automation, and clean energy applications.
He further added that the project demonstrates how domestic capability-building, combined with international collaboration, can strengthen India’s position as a reliable OSAT hub for global OEMs and semiconductor firms seeking resilient and diversified supply chains.
A Turning Point
As the company prepares for mass production next year, Kaynes Semicon’s achievement signifies a turning point in the country’s semiconductor manufacturing landscape.
It not only validates India’s engineering expertise but also lays the foundation for future innovations in power electronics, chip packaging, and integrated module design.
With this landmark success, India takes a decisive step toward realizing its semiconductor ambitions—transforming from a consumer nation to a key contributor in the global technology ecosystem.
Key Comments
Raghu Panicker, CEO of Kaynes Semicon, shared his thoughts on this achievement:
“This milestone reflects our team’s dedication, rapid execution, and commitment to quality. Together with our global partners, we are creating a new chapter in India’s semiconductor story—where innovation, reliability, and scale come together to make India a trusted node in the global semiconductor supply chain.”
