Intel’s tie-up with Black Sesame Technologies, a Shanghai-based AI chip designer, centers on creating a cross-domain computing platform that unifies cockpit and autonomous driving systems. 
Driving next-gen autonomous and smart in-vehicle experiences through strategic global alliances. Intel Bets Big on Software-Defined Vehicles and AI Chips.
At the 2025 Shanghai Auto Show, Intel announced landmark partnerships with three major players in the automotive semiconductor and AI ecosystem: Black Sesame Technologies, Model Best, and BOS Semiconductors. These alliances underscore Intel’s aggressive push to position itself at the heart of next-generation software-defined vehicles (SDVs), edge AI systems, and custom automotive chiplets.
Intel is expanding beyond its x86 roots and signaling its ambition to become a critical supplier of chips and platforms that power advanced driver-assistance systems (ADAS), digital cockpits, and autonomous driving solutions.
“We are committed to building an open, collaborative automotive ecosystem. These partnerships represent the next phase of Intel’s strategy to accelerate smart mobility,” said Jack Weast, VP and General Manager of Intel Automotive.
Black Sesame Technologies: Strengthening Integrated Cockpit and Driving Compute Platforms
Combining Intel SoCs with Huashan & Wudang series for robust AI performance
Intel’s tie-up with Black Sesame Technologies, a Shanghai-based AI chip designer, centers on creating a cross-domain computing platform that unifies cockpit and autonomous driving systems. The joint solution integrates:
- Intel’s SDV-oriented SoC (with on-chip AI acceleration)
- Black Sesame’s Huashan A2000 and Wudang C1200 processors
This combination targets vehicle platforms from Level 2+ to Level 4 autonomy, bringing AI-rich experiences to cockpits while simultaneously enabling decision-making for ADAS.
“Automakers demand scalable compute solutions that don’t compromise on performance or cost. Our collaboration with Intel enables exactly that,” said Dr. Hui Wu, CEO of Black Sesame Technologies.
Reference Design Launch in Q2 2025
The companies have co-developed a reference design set to launch by June 2025, and full mass production is expected to begin by late 2025. This platform promises a high compute-to-cost ratio by combining dedicated AI accelerators with automotive-grade reliability.
About Black Sesame
Black Sesame was founded in 2016 and has grown into a leader in smart vehicle semiconductors. The Huashan A1000 series focuses on visual perception and autonomous decision-making, while the Wudang C-series supports complex in-vehicle computing tasks.
Model Best: Pioneering Edge-Based AI for Offline Vehicle Agents
Creating intelligent voice and interaction systems without cloud dependency
Model Best, a Chinese startup specializing in edge inference models, is working with Intel to build the industry’s first fully offline intelligent in-car agent. Unlike traditional systems that rely on cloud servers, this cockpit interface:
- Operates independently at the edge, reducing latency and data costs
- Uses Intel’s compute power for real-time, local natural language processing (NLP)
- Delivers seamless voice control and GUI-based assistance—even in low-connectivity regions
Solving Latency and Privacy Bottlenecks
“By combining Intel’s efficient memory architecture with our edge-side LLMs, we’re bringing smart interaction to the car in real time,” said Liu Xiaohong, CTO at Model Best.
The solution leverages a native GUI-based experience backed by large language model (LLM) reasoning without requiring internet access. This brings enhanced data privacy and better performance for rural or international markets where network connectivity may be limited.
BOS Semiconductors: Bringing Modular Chiplet AI to Automotive
Hyundai-backed startup unveils chiplet-based AI platform for autonomy and infotainment
The most technically daring of Intel’s new partnerships is with BOS Semiconductors, a South Korean firm backed by Hyundai Motor Group. Their collaboration focuses on chiplet-based AI accelerators for:
- In-vehicle infotainment (IVI)
- Smart dashboards
- Advanced AI compute for autonomous driving
Eagle-N: World’s First Automotive Chiplet AI Accelerator
BOS recently introduced “Eagle-N”, the world’s first chiplet AI accelerator for vehicles, which is:
- Customizable by OEMs to reduce hardware refresh cycles
- Scalable for both infotainment and autonomous driving systems
- Based on chiplet architecture that allows modular upgrades without redesigning full SoCs
“The future of auto chips is modular and scalable. Intel’s ecosystem tools help us deliver next-gen AI with faster time-to-market,” said Daniel Kim, CEO of BOS Semiconductors.
The Eagle-N chips will debut at CES 2026 and are slated for production by late 2026.
Integration with Arteris and Magillem IP
To enhance SoC integration and reduce complexity, BOS is using Arteris FlexNoC interconnects and Magillem Gold Suite IP. This enables high-bandwidth data movement, low latency, and efficient power management—key traits for edge and AI-dominated automotive use cases.
Intel’s Broader Automotive Strategy: SDVs and Open Ecosystems
Building an industry-standard, AI-first mobility platform
Intel is positioning itself not merely as a chip supplier, but as a mobility platform enabler. By partnering with Black Sesame, Model Best, and BOS Semiconductors, Intel is creating:
- A modular stack from silicon to software
- AI-centric compute platforms tailored to each automaker’s use case
- A global supplier base to serve China, Korea, and international OEMs
“We want to enable carmakers to build safe, immersive, and intelligent vehicles, faster and at scale,” said Intel’s Jack Weast during the announcement.
Intel’s focus on open collaboration, rather than vertical integration, differentiates it from rivals like NVIDIA or Tesla. This could make Intel a preferred choice for global OEMs looking to avoid vendor lock-in.
Outlook and Implications
Why This Matters for Automakers, Investors, and Tech Ecosystem
- For OEMs: These partnerships give automakers more flexibility in deploying localized, scalable AI without building everything in-house.
- For investors: Intel’s focus on automotive gives it a high-growth revenue stream amid slowing PC/server markets.
- For consumers: Expect smarter, more interactive, and safer vehicles entering production from 2026 onward, particularly in Asia.
Intel’s Global Alliances Redefine Automotive Innovation
Intel’s partnerships with Black Sesame, Model Best, and BOS Semiconductors represent a strategic leap into automotive AI and chip modularization. These alliances solidify Intel’s commitment to AI-enabled, software-defined mobility, and its belief that an open, distributed ecosystem is the future of transportation.
