Eletronic passports are paving the way making traditional passports a time period in history. Electronic passports bring high security standards make them contactless and avoid tampering and fraud.
Infineon Technologies announces that its electronic passports with contactless Coil on Module (CoM CL) solution have been opted by Türkiye. Türkiye’s population has grown to nearly 86 million people by 2023 and is still growing. As a result, the demand for fraud-resistant passports is growing. Türkiye has ordered nearly five million next-generation electronic passports with contactless Coil on Module (CoM CL) solution from Infineon Technologies, the company stated in its official release.
What’s Inside Infineon’s New Electronic Passports With Contactless Coil on Module (CoM CL) Solution:
- A polycarbonate (PC) data page with an integrated security chip, which is embedded in a contactless module based on the reliable CoM technology.
- The data page contains sensitive personal data of the holder.
- Due to the security-critical nature of this information, official travel documents must be designed to highest security standards in order to provide reliable protection against tampering and fraud.
- Infineon’s contactless CoM solution not only increases the robustness of the ePassport, but also enables enhanced security.
- Coil on Module technology for enhanced security and reliability
- Infineon’s FCOS™ (Flip Chip on Substrate) manufacturing technology enables the production of a module with a thickness of only 125 µm, which is up to 50 percent thinner than conventional contactless modules.
- Facilitates the production of ultra-thin antenna inlays of approximately 200 µm for passport eDatapages that are approximately 500 µm thick.
- The reduced thickness allows the issuing state printer to embed additional security layers in the ePassport’s PC eDatapage to meet highest security standards.
“At Infineon, we are delighted to continue our role as a trusted partner to Türkiye by consistently integrating our security components into the new government identity eDocuments,” said Maurizio Skerlj, Vice President Authentication & Identity Solutions at Infineon’s Connected Secure Systems Division. “Enabled by embedded Infineon components, the new eDatapage is only 630 µm thick, making it one of the thinnest in the world. We are very proud of this attractive and reliable product that represents the next level of document security and design.”
The Turkish ePassport Will Be Presented At Infineon’s Booth at TRUSTECH 2023, Visit Here: www.infineon.com/trustech.
