A notable trend in the electronics sector is the move toward smaller, more powerful systems. Infineon Technologies is adding two new product families to its range of discrete CoolSiC MOSFETs 650 V, which are housed in Q-DPAK and TOLL packages, in order to complement this trend and further spur innovation at the system level.
The CoolSiC Generation 2 (G2) technology serves as the foundation for these varied Discrete CoolSiC MOSFETs product families, which provide top- and bottom-side cooling and much enhanced performance, reliability, and user-friendliness.
The Discrete CoolSiC MOSFETs product families focus on high- and medium-power switched-mode power supplies (SMPS), such as solid-state circuit breakers, televisions, drives, e-mobility and humanoid robots, AI servers, renewable energy, and chargers for electric vehicles.
By minimizing the footprint of printed circuit boards (PCBs), the TOLL package’s exceptional Thermal Cycling on Board (TCoB) performance makes it possible to create small systems. It can also lower manufacturing costs at the system level when utilized in SMPS. Now that the TOLL package is compatible with a wider range of target applications, PCB designers can further cut prices and better satisfy consumer demands.
Alongside the continuous development of Infineon’s new family of Topside Cooled (TSC) devices, which includes CoolMOS 8, CoolSiC, CoolGaNTM, and OptiMOS, the Q-DPAK packaging has been introduced.
Customers can attain exceptional resilience, maximum power density, and system efficiency at a low cost with the TSC family.
Additionally, it permits 95 percent direct heat dissipation, which permits the PCB to be used on both sides for improved space management and a decrease in parasitic effects.
Availability
The CoolSiC™ MOSFETs 650 V G2 in TOLL are now available in RDS(on) from 10 to 60 m?, while the Q-DPAK variant is available in 7, 10, 15 and 20 m?.
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