At embedded world 2026, Infineon will highlight its XENSIV sensor portfolio and demonstrate how advanced sensor data underpins advanced automotive, industrial, and consumer applications.
Next-generation embedded systems are becoming the backbone of our connected world from high-performance sensors that capture critical data to advanced microcontrollers (MCUs) that process and interpret it in real time.
At embedded world 2026, kicking-off from 10–12 March in Nuremberg, Germany, Infineon Technologies will showcase how its semiconductor innovations enable green, efficient energy, clean and safe mobility, and an intelligent, secure IoT – all under the motto “Driving decarbonization and digitalization. Together.” at Hall 4A, Booth 138.
Infineon’s presence will center on how its microcontroller and sensor portfolios power applications across AI, IoT, automotive, and robotics to support a more sustainable future.?
Microcontrollers: the brain of embedded intelligence
MCUs sit at the heart of modern embedded systems, orchestrating control, computation, and connectivity across countless applications.
In Nuremberg, Infineon will bring this to life with live demos that show real-world use cases, including:?
- Edge AI and robotics: PSoC™ and AURIX™ MCUs delivering deterministic real-time processing, adaptive control, functional safety, and secure connectivity for intelligent robots and edge devices.
- Software-defined vehicles (SDV): A TRAVEO™ SDV zonal demo highlighting how automotive MCUs enable zonal E/E architectures, OTA updates, and software-driven features in next-generation vehicles.
- Industrial and IoT systems: Energy-efficient MCUs that combine performance, safety, and robust cybersecurity to power smart devices and help manufacturers prepare for the upcoming European Cyber Resilience Act (CRA).
XENSIV™ sensors: connecting the physical and digital worlds
Sensors form the critical link between the real world and digital processing, enabling accurate data capture for control, monitoring, and decision-making.
At embedded world 2026, Infineon will highlight its XENSIV™ sensor portfolio and demonstrate how rich sensor data underpins advanced automotive, industrial, and consumer applications:?
- Robotics and Edge AI: Demos where XENSIV sensors let robots “see, hear, and feel” their environment, providing the situational awareness needed for safe interaction and autonomous behavior.
- Automotive and SDV use cases: Radar, magnetic, and current sensors supporting perception, condition monitoring, and zonal architectures in modern vehicles.
- IoT and industrial solutions: Showcases including the next-generation XENSIV CMOS 60 GHz radar for IoT, plus MEMS microphones and other sensors that deliver reliable, high-fidelity data for connected, energy-efficient devices.
Throughout the show, Infineon experts will also deliver in-depth presentations on how its MCUs and sensors enable efficient, secure, and fast innovation in AI, robotics, IoT, and software-defined vehicles giving engineers practical insight into building the next wave of embedded systems.
More information on the individual presentations is available at, CLICK HERE
Infineon Technologies at embedded world
Embedded world will take place in Nuremberg, Germany, from 10 to 12 March, 2026. Infineon will present its products and solutions for decarbonization and digitalization in hall 4A, booth 138.
