For calculating losses and thermal behavior of power modules, discrete devices, and disc devices, Infineon Power Simulation Platform (IPOSIM) is frequently used. A SPICE-based model generation tool that adds gate driver selection and external circuitry to system-level simulations is now integrated into the platform.
The tool takes into account the non-linear semiconductor physics of the devices to provide more accurate findings for static, dynamic, and thermal performance. This facilitates quicker design decisions and advanced device comparison across a broad variety of operational scenarios. Additionally, within the workflow, developers can alter their application environment to replicate real-world operational situations.
They can thereby minimize costly design modifications, speed up time-to-market, and maximize application performance. Electric vehicle (EV) charging, solar, motor drives, energy storage systems (ESS), and industrial power supply are just a few of the many applications where switching power and thermal performance are crucial, and IPOSIM integrates SPICE to support them all.
IPOSIM helps customers optimize their designs early in the development process by bringing the modeling of real switching behavior completely online through the integration of SPICE.
The models allow for the inclusion of crucial characteristics like dead time, gate voltage, and stray inductance by expanding system simulation to real-world situations. Considering the chosen gate driver, the device characterisation depicts the switching behavior under more realistic operational conditions.
Users can choose devices with the SPICE icon, set up application contexts, and follow a guided simulation procedure thanks to the capability’s complete integration into IPOSIM’s multi-device comparison workflow.
Power electronics are crucial to enabling greener energy systems, environmentally friendly transportation, and more productive industrial processes in the global shift to a decarbonized future.
The need for advanced simulation and validation tools that enable designers to experiment early in the development cycle is growing as a result of this shift. They must simultaneously minimize design iterations and development costs while producing highly efficient, high-power-density solutions, such as industrial power supplies, motor drives, solar inverters, and EV chargers.
In this process, switching losses and thermal performance are critical aspects; nevertheless, standard hardware testing is still expensive, time-consuming, and has limited ability to capture real-world conditions.
IPOSIM’s new SPICE-based models is said to provide greater reliability design choices and quicker device selection because to their system-level correctness and user-friendly workflow. The solution is free, accessible online, and completely integrated into IPOSIM.
Availability
IPOSIM with SPICE is available now at www.infineon.com/iposim.
Free company registration is required to use the feature. Available topologies and devices are marked with a SPICE icon.
The first version supports 1200 V silicon carbide discrete devices in IPOSIM’s predefined 3-phase 2-level (discretes) topology, together with 36 compatible gate drivers. Future updates will extend coverage to CoolMOS™, CoolSiC™ modules, OptiMOS™, and GaN devices and more gate driver devices.
