Infineon Added Bluetooth Portfolio To Expand Car Access, wBMS Focus

Eight new products of the AIROC CYW20829 Bluetooth Low Energy 5.4 microcontroller (MCU) family, which include systems-on-chips (SoCs) and modules tailored for consumer, business, and automotive use cases, have been added to Infineon Technologies’ Bluetooth portfolio.

Designers can lower the bill-of-material (BOM) cost and device footprint in a wide range of applications, such as low-energy audio, wearables, solar micro inverters, asset trackers, health and lifestyle, home automation, and PC accessories, thanks to the high integration of the CYW20829 product family.

With support for secure boot and execution environments and cryptographic acceleration to protect sensitive data, Infineon’s strong development infrastructure and dedication to security also assist product designers, stated its official release.

Due to its strong RF performance, long range, and the newest Bluetooth 5.4 features, such as PAwR (Periodic Advertising with Responses), the AIROC CYW89829 Bluetooth Low-Energy MCU is the newest automotive component in the product family.

It is perfect for car access and wireless battery management systems (wBMS) applications. With separate application and Bluetooth Low Energy subsystems, the chip family’s dual ARM® Cortex® core design offers full Bluetooth 5.4 support, low power (10 dBm output power without a PA), integrated flash, CAN FD, crypto accelerators, high security (including Root of Trust (RoT), and PSA level 1 readiness.

“Infineon offers one of the industry’s broadest portfolios of IoT solutions. Our Bluetooth solutions offer robust connectivity and the latest features,” said Shantanu Bhalerao, Vice President of the Bluetooth Product Line, Infineon Technologies. “Our automotive AIROC CYW89829 Bluetooth LE MCU, and versatile AIROC Bluetooth CYW20829 LE MCU deliver ultra-low power and a high degree of integration for a better user experience across various applications in automotive, industrial, and consumer markets.”

Positive reviews have been received by Infineon while collaborating with customers to design using the current CYW20829 family of products:

“The Infineon CYW20829 is the leading Bluetooth part in the market, which has passed the latest Bluetooth 5.4 certification,” said Kevin Wang, CEO of ITON. “CYW20829 has very good RF performance, supports PAwR and LE Audio. These features bring more possibilities in consumer and industrial markets.”

“CYW20829, with perfect RF performance, flexible API, and good long-range features, provides a good solution for commercial lighting, industrial IoT, and more,” said Cai Yi, CEO of Pairlink.

“Earlier this year, the Bluetooth SIG released version 5.4 of the specification with new features: Periodic Advertising with Responses and Encrypted Advertising Data. These features implemented on Infineon’s CYW20829 chips allow Addverb to develop a secure monitoring and controlling system for a fleet of wireless robots in the industrial warehouse, satisfying safety requirements,” said Tapan Pattnayak, Chief Scientist at Addverb, a global leader in robotics.

Availability

The new products are available in a range of variants, each with its specific characteristics
and focus applications.

Products currently in production are:

• CYW20829B0000, in a 56QFN SoC package, 6×6 mm, designed for PC accessories, remotes, ESL, and low-end BLE MCUs
• CYW20829B0010, packaged in 56QFN SoC with a dimension of 6×6 mm, suitable for gaming accessories and LE Audio products
• CYW20829B0-P4EPI100 and CYW20829B0-P4TAI100 modules, both with a dimension of 14.5×19 mm, suitable for long-range, asset tracking, power tools, and generic Bluetooth LE use cases

Sampling now are:

• CYW20829B0021, in a 40QFN SoC package, 6×6 mm, suited for industrial and long-range applications
• CYW89829B0022, in a 40QFN SoC package 6×6 mm, designed for wireless BMS and car access
• CYW89829B0232, in a 77BGA SoC package, 7×8 mm, suitable for wireless BMS and car access

• In the second quarter of 2025, samples are expected of the CYW20829B1230, which will be available in a 64 Ball BGA SoC package with a dimension of 4.5×4.5 mm and suitable for wearables, power tools, and asset tracking

Further info related to the AIROC CYW20829 Bluetooth LE MCU family can be found here.
Further info related to the AIROC CYW89829 Bluetooth LE MCU can be found here.