Heilind Asia Pacific has announced that it will be at the Shenzhen Convention & Exhibition Center (Futian) from August 26–28, 2025, for the Shenzhen International Electronics Show (ELEXCON 2025).
Heilind will showcase a variety of TE Connectivity, Molex, and GCT solutions at Booth 1U20, Hall 1. These solutions include innovative connectors, interconnect systems, and components made for AI applications and sustainable technologies.
These devices meet the rising need in industries including industrial automation, electric vehicles, automotive, renewable energy, and the Internet of Things.
Experts from Heilind Asia Pacific will be available on-site starting on August 26th to offer technical assistance, exchange knowledge, and talk about customized solutions that address changing market demands.
“Come along with us as we advance solutions that promote a more sustainable and greener future and accelerate the development of AI,” stated the leading distributor in its official release.
Event Details:
- Date: August 26–28, 2025
- Booth:Â Hall 1, Booth 1U20
- Venue:Â Shenzhen Convention & Exhibition Center (Futian)
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