Hanmi Semiconductor has announced the launch of its next-generation EMI Shield 2.0, designed to meet the stringent electromagnetic interference (EMI) shielding requirements of advanced aerospace systems.
The new EMI Shield 2.0 solution enhances signal integrity, minimizes electromagnetic leakage, and ensures higher reliability for mission-critical aerospace electronics.
With increasing demand for high-performance avionics and communication modules, the upgraded platform delivers finer pattern precision, improved production speed, and superior shielding effectiveness.
According to Hanmi Semiconductor, the latest version integrates an advanced process architecture that reduces equipment footprint while improving yield rates. The system supports automated handling for multi-layered shielding films, enabling manufacturers to streamline their assembly and inspection workflows.
With this launch, Hanmi aims to strengthen its presence beyond conventional semiconductor manufacturing and into high-reliability industries such as aerospace, defense, and satellite communications.
The company plans to collaborate with aerospace component makers to expand adoption of the EMI Shield 2.0 platform globally.
Key Comment
“The EMI Shield 2.0 marks a significant milestone in extending our packaging equipment capabilities into the aerospace sector,” said a Hanmi Semiconductor spokesperson. “As electronic density rises across aerospace and defense systems, our technology provides manufacturers with an ultra-precise, scalable, and cost-effective solution for EMI protection.”
