Announcing its membership in the TSMC Open Innovation Platform (OIP) Design Center Alliance (DCA), eInfochips, an Arrow Electronics firm, made the announcement.
With the goal of lowering design obstacles for clients implementing TSMC technology, the TSMC DCA program focuses on chip implementation services and system-level design solutions.
The product engineering and semiconductor design services firm joins this Alliance with a wealth of knowledge and a proven track record of tape-out success with TSMC’s cutting-edge process technology.
“Our collaboration with the TSMC DCA program signifies a pivotal moment for eInfochips,” said Mangesh Kulkarni, vice president and general manager of semiconductor practice at eInfochips. “It reflects our deep expertise and positions us to offer an expanded range of design and testing services, utilizing TSMC’s latest technological advancements.”
“We are pleased to welcome eInfochips to the TSMC Design Center Alliance, and we are confident that eInfochip’s expertise will greatly assist our mutual customers in achieving first-time silicon success,” said Dan Kochpatcharin, Head of Design Infrastructure Management Division at TSMC. “TSMC is committed to collaborating with our OIP ecosystem, including eInfochips, to empower designers in achieving their design goals and quickly bringing their innovation to market.”
Through this partnership, eInfochips, which has over 25 years of ground-breaking experience in ER&D, plans to expand the range of silicon engineering services it provides.
The business has played a key role in the development of next-generation system-on-a-chips (SoCs), using process technologies spanning from 180nm to 3nm.
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