For a consideration of up to INR 400 Crore (EUR 42.5 million), Tessolve, a Hero Electronix venture and a top supplier of semiconductor engineering solutions for cutting-edge chips, announced the final agreement to buy 100% of Dream Chip Technologies, a German semiconductor chip design company.
With this acquisition, Tessolve is now known to be among the few design companies in the world that can provide comprehensive design solutions for intricate, cutting-edge semiconductors.
By incorporating cutting-edge capabilities in System on Chip (SoC) designs for the industrial, data center, automotive, and artificial intelligence (AI) applications, it further solidifies Tessolve’s position as the industry leader.
Growing Dominance in Semiconductor Services Industry
In addition to strengthening Tessolve’s dedication to offering state-of-the-art semiconductor and embedded design solutions, the acquisition will increase Tessolve’s market share in the semiconductor services industry by adding four delivery locations throughout Germany and the Netherlands, including a dedicated ADAS & imaging center-of-excellence lab.
With its headquarters in Germany and a highly skilled staff of solution architects and specialist engineers, Dream Chip Technologies is regarded as one of the top providers of semiconductor design services in the area, especially for its proficiency with intricate digital designs.
Tessolve Foster Post-Silicon Test and Packaging Design
Tessolve’s fosters in chip design and unmatched excellence in post-silicon test and packaging design, along with its chip architecture and front-end design capabilities, will help the company provide full chip turnkey design solutions from specification to volume silicon production, giving customers a crucial “time to market” advantage and “operational excellence.” The purchase is being made entirely with cash.
“This acquisition solidifies our position as a top tier semiconductor engineering firm globally with unmatched design to productization capabilities,” said Srini Chinamilli, Co-founder & CEO of Tessolve. “Dream Chip’s capabilities further strengthen our ability to take on leading edge ASIC design projects and greatly enhances our European footprint,” he added.
“We are excited to join forces with Tessolve and bring our expertise in digital chip design and embedded software to a global platform. By combining our design capabilities and IP with Tessolve’s established semiconductor services and embedded solutions, we can offer our customers a truly end-to-end solution from chip architecture to post-silicon test and supply chain management for their most complex designs,” said Jens Benndorf, CEO of Dream Chip Technologies. “Together, we will push the boundaries of innovation in automotive and enterprise designs, particularly in camera-based systems and AI-driven ASIC applications,” he added.
Mr. Ujjwal Munjal, Chairman of Tessolve, remarked, “Over the past few years, Tessolve has demonstrated impressive growth and resilience. With the synergy brought by Dream Chip Technologies, I am confident that Tessolve is poised to become a world leader in this space with unparalleled capabilities. As major companies increasingly shift towards custom chip design, this acquisition positions Tessolve more strongly than ever to meet the growing demands of the custom chip market.”
Regulatory permits are required before the signing can take place.
