The company, Daxin Materials, which supplies specialty chemicals for semiconductor, display, and essential raw materials, claims to have increased semiconductor industry revenue.
This news comes amidst, Daxin Materials claims to have developed a unique chipmaking material which is sought to support advanced 2nm manufacturing processes and CoWoS packaging.
The Growing Importance of CoWoS Packaging
A scalable package was believed to be necessary to meet the computational demands for artificial intelligence (AI) and high performance computing (HPC). A more advanced packaging approach known as “chip-on-wafer-on-substrate” (CoWoS) has the benefit of a bigger package size and more I/O connections.
It enables both heterogeneous and homogeneous integration by allowing 2.5D and 3D component stacking. High bandwidth memory (HBM) is used in modern data centers to increase memory capacity and bandwidth because earlier systems had memory constraints. Heterogeneous integration of logic SoC and HBM on the same IC platform is made possible by CoWoS technology.
Research, development, manufacturing, and distribution of display and critical raw materials, as well as specialty chemicals, for semiconductors, are the activities carried out by Daxin Materials Corporation in Taiwan, China, Japan, and other countries.
Daxin Materials provides display materials including LCD, touch panel, and flexible OLED/EPD materials; semiconductor materials like laser release layers and photosensitive dielectrics; and essential raw ingredients such as anhydride monomers.
Additionally, it provides instrument analysis solutions that include material testing, composition, impurity, and quantitation analysis for materials used in semiconductor, flat panel display, solar energy, and chemical industries. The company was incorporated in 2006 and is headquartered in Taichung City, Taiwan.
On the other hand, TSMC’s 2nm process will arrive in 2026. TSMC 2nm manufacturing processes to Commence in 2025.
