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The Thermal Management Group of CUI Devices has announced that their range of BGA heat sinks has expanded. The new HSB series fostering BGA heat sinks are compatible with ball grid array (BGA) devices.
The new HSB series comes with options for copper or aluminum material, clean or black anodized material finishes, and PCB or adhesive mounting methods.
It is easy for designers to choose the best heat sink for their forced air cooling or natural convection system since all BGA heat sink types are simply assessed for thermal resistance under four scenarios.
The HSB series from CUI Devices come in a variety of sizes, ranging from 8.5 x 8.5 mm to 69.7 x 69.7 mm, with profiles ranging from 5 to 25 mm. They have power dissipation ratings of 1.92 to 21.74 W at 75°C ?T in natural convection and thermal resistances of 3.45 to 39.1°C/W at 75°C ?T.
Key Features
Measured under four conditions for thermal resistance
Key Applications
Ball grid array applications
Availability and Pricing
The HSB models are available immediately with prices starting at $0.51 per unit at 500 pieces through distribution.
contact CUI Devices for OEM pricing.
For helpful resources and tools on heat sinks: Resource Library
View details for CUI Devices’ BGA heat sinks
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