A major trend in the electronics sector is moving toward compact, more powerful systems due to increased attention on decarbonization and technological improvements. With the release of the Thin-TOLL 8×8 and TOLT packages, Infineon Technologies is proactively promoting and expediting these developments.
They allow the PCB mainboard and daughter cards to be used to their fullest potential while also taking the system’s size constraints and thermal needs into consideration.
Infineon is currently adding two new product families to its lineup of CoolSiC MOSFET discretes 650 V, which are housed in the Thin-TOLL 8×8 and TOLT packaging. Based on the CoolSiC Generation 2 (G2) technology, they provide markedly enhanced figures-of-merit, dependability, and user-friendliness.
Particularly targeted at high and medium switching-mode power supply (SMPS) are the two product families; they include EV chargers, AI servers, renewable energy, and big household appliances.
With its 8×8 mm form size, the Thin-TOLL package provides the market’s finest Thermal Cycling on Board (TCoB) capabilities. A top-side cooled (TSC) enclosure with a form factor resembling that of TOLL is the TOLT package.
Both package kinds provide a number of advantages to developers. For example, using them in AI and server power supply units (PSU) allows for a flat heat sink and decreases the thickness and length of the daughter cards.
The Thin-TOLL 8×8 package minimizes the PCB area taken up by the power supply components on the mainboard when used in microinverters, 5G PSU, TV PSU, and SMPS. Since convection cooling is usually used in these applications, TOLT controls the junction temperature of the components.
Furthermore, Infineon’s top-side cooled CoolSiC industrial portfolio—which includes CoolSiC 750 V in Q-DPAK—is completed with TOLT devices. When the power to be given to the devices does not need a Q-DPAK package, they allow engineers to minimize the PCB footprint occupied by SiC MOSFETs.
Availability
The CoolSiC MOSFETs 650 V G2 in ThinTOLL 8×8 and TOLT are now available in RDS(on) from 20, 40, 50 and 60 m?. Additionally, the TOLT variant is also available with an RDS(on) of 15 m?. The product family will be expanded by a more granular portfolio by the end of 2024. More information is available at www.infineon.com/coolsic-gen2.
Infineon will showcase the CoolSiC MOSFET 650 V Generation 2 at the PCIM in Nuremberg.
Infineon at the PCIM Europe 2024
PCIM Europe will take place in Nuremberg, Germany, from 11 to 13 June 2024. Infineon will present its products and solutions for decarbonization and digitalization in hall 7, booths #470 and #169. Company representatives will also be giving several presentations at the accompanying PCIM Conference and Forums, followed by discussions with the speakers.
