Infineon Technologies introduces the CoolSET System in Package (SiP), a compact and integrated power controller capable of delivering up to 60 W at a universal input voltage range of 85-305 VAC.
The high-voltage MOSFET with low RDS(ON) is housed in a compact SMD package, eliminating the need for an external heat sink, hence decreasing system size and complexity.
The CoolSET SiP provides zero-voltage switching (ZVS) flyback operation, which reduces switching losses and EMI signature while increasing system dependability and resilience.
This makes it an excellent choice for applications like large home appliances and AI servers. Furthermore, the controller makes it easy for engineers to meet severe energy regulations, hence facilitating future-proof power solutions for current designs.
The CoolSET SiP Integrates:
- A 950 V startup-cell, an 800 V avalanche rugged CoolMOS P7 SJ MOSFET, a ZVS primary flyback controller, a secondary-side synchronous rectification (SR) controller, and reinforced isolated communication enabled by Infineon’s proprietary CT Link technology.
- This high level of integration supports the development of more sophisticated end products by significantly reducing the number of discrete components, lowering the bill of materials, and minimizing PCB space requirements.
- A comprehensive set of advanced protection features simplifies system integration and allows designers more flexibility to optimize their solutions and enhance the overall user experience.
Availability
Infineon’s CoolSET System in Package (SiP) product samples are available to order. Infineon will show a demo version at PCIM Europe 2025.
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