Mitsubishi Electric Corporation declared that it has developed a new, compact version of its DIPIPM power semiconductor modules especially for use in industrial and consumer devices such heat pump heating and hot water systems and packaged air conditioners.
Samples of the PSS30SF1F6 (rated current 30A / rated voltage 600V) and PSS50SF1F6 (rated current 50A / rated voltage 600V) products of the new Compact DIPIPM series will start to ship on September 22.
The module’s footprint is nearly 53% smaller than that of the company’s traditional Mini DIPIPM Ver.7 series of products thanks to the use of reverse-conducting insulated-gate bipolar transistors (RC-IGBTs), allowing for more compact inverter substrates in packaged air conditioners and other applications.
From September 24 to 26, the new items will be on display at Power Conversion and Intelligent Motion (PCIM) Asia Shanghai 2025 in Shanghai, China.
Since power semiconductors are essential components for effectively converting DC to AC current, their demand has increased recently.
The power conversion equipment of inverters that regulate outdoor unit compressors and fans uses power semiconductor modules for packaged air conditioners, heat pump heating systems, and hot water systems.
In order to achieve energy savings in air conditioning systems and help realize a decarbonized society, the global transition to inverters is accelerating.
Smaller parts like inverter substrates are becoming more and more in demand as a result of the growing requirement for outdoor packaged air conditioner and heat pump components that are more compact in order to enhance performance and lessen their environmental impact.
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