Memory Trends in 2024: Low-Power, Sustainability at Verge

If 2023 has shown us anything, it...

Tweaked Yokogawa CENTUM VP Supports Industrial Networks

CENTUMTM VP R6.11.10, an improved version of...

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i-Chips FPGA Development Board for Image Processing Circuits

i-Chips has rolled out the new iEB-KXU2 is a 4K 60Hz input/output FPGA development board. The new input/output FPGA development board by i-Chips targets the...

iCHIPS, TiE Silicon, VSI to Organise Global Semiconductor Event

iCHIPS has recently announced a strategic event-specific collaboration with TiE Silicon Valley and VLSI Society of India (VSI). Under this partnership, iCHIPS, TiE Silicon Valley...

SDVs Software, Hardware Integration Gets Seamless

NXP Semiconductors announces to have made a groundbreaking development in next-gen software-defined vehicle (SDV) development. NXP’s  S32 CoreRide platform is known to have broken...

China’s Influence on Indian EV, Auto Mfg. to Grow – GTRI

The supply chain reliance on China needs to be taken care of, also the Union Government of India needs to take cognizance of the...

What Changes, India Test-Fires Stage-2 Vikram-1 Space Launch Vehicle

Skyroot Aerospace officially announces the successful test-firing of the Stage-2 of Vikram-1 space launch vehicle. The Stage-2 of Vikram-1 space launch vehicle test fired has...

VIAVI RAN Intelligence Test and Training at 2024 RIC Forum

VIAVI Solutions announces its participation in the 2024 RIC Forum, March 26-28, in Dallas, Texas. VIAVI contributed its TeraVM RIC Test and TM500 Network...

What’s Truly Driving the RPA Market in 2024?

What’s driving the robotic process automation(RPA) market? The latest study has stated that growing investments in automation R&D and, availability of technologies including RPA...

Grrenliant BGA SSD Now With PCIe NVMe Interface

Greenliant is now sampling its new NVMe NANDrive ball grid array (BGA) solid-state drives (SSDs). Catering the growing demand for embedded systems data storage,...

SmartSoC Now A Part of TSMC’s Design Center Alliance

SmartSoC Solutions announces its membership in the Design Center Alliance (DCA) of TSMC’s Open Innovation Platform® (OIP). Under this new partnership with TSMC Design Center...

R&S First to Test Bluetooth Channel Sounding Signals

Rohde & Schwarz announces that the company will showcase measurements on novel Bluetooth Channel Sounding signals for positioning accuracy during the upcoming Embedded World. The...

SE, NVIDIA Unlocks the Full Potential of AI Data Centers

Schneider Electric, NVIDIA partners to scale up modern data centers. The duo aims to create next-gen AI data centers and advance towards edge artificial...

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