MIKROE rolled out the SmartMCD TB9M001FTG, a game-changing motor control development board perfect for automotive body electronics.
At its heart sits Toshiba's automotive-grade  TB9M001FTG SmartMCD...
Teledyne FLIR OEM Introduces Lepton XDS Dual Thermal and Visible Camera Module.
Teledyne FLIR OEM has unveiled the Lepton XDS, a compact dual thermal and...
Intel Corporation appears to be cooking up CPUs with unified cores architecture, moving beyond its current hybrid P-and E-core setup, a shift hinted at...
MIKROE has introduced the EnOcean 5 Click, a new wireless connectivity  Click board™ designed to streamline communication with EnOcean-based sensors, switches, and actuators. As part...
Renesas Electronics Corporation has unveiled a new configurable 3nm TCAM.
Built on an advanced 3nm FinFET process, it achieves a rare combination of high density,...
Ambiq Micro has introduced soundKIT, the fourth addition to its open-source AI Development Kit (ADK) lineup. It is engineered to accelerate the adoption of always-on,...
Microchip Technology is advancing its edge AI capabilities through comprehensive full-stack solutions, enabling developers to rapidly deploy production-grade applications on its MCUs and MPUs. These...
A new-generation 5G RedCap chipset platform has been introduced to accelerate industrial and enterprise IoT deployments by delivering a focused balance of performance, energy...
Chennai-based Aheesa Digital Innovations has successfully taped out India's first domestically designed RISC-V network SoC, the VIHAAN-I on a mature 28-nm process node.
This breakthrough...
THine Electronics has introduced a groundbreaking optical DSP-free chipset featuring its proprietary ZERO EYE SKEW technology, targeting short-reach optical links in PCI Express 7...
Bengaluru-based semiconductor design firm Mirafra Technologies has successfully taped out its in-house developed Ramanujan SoC on TSMC's 22-nm process, marking a key step in...