EMBEDDED
TSMC Sets New Standard in Silicon Photonics Announces 1.6T Optical Transmission
With its cutting-edge co-packaged optics technology, TSMC sets a new standard in silicon photonics and is set to introduce 1.6T optical transmission in 2025. In...
MediaTek Dimensity 8400 – First All-Big-Core Chip for High-End Smartphones
The Dimensity 8400, a high-end smartphone chip with the strongest Gen-AI performance in its class, was unveiled by MediaTek. The MediaTek Dimensity 8400, which...
Forlinx Embedded Launches New FET-MA35-S2 SoM Based on Nuvoton MA35D1
Nuvoton's NuMicro MA35D1 series microprocessors have become the engineers' trusted choice for high-end industrial control, edge IoT gateway, and HMI applications due to their...
New Microchip VDFN8 Package ATA650x CAN FD SBCs Flaunts Small Footprint
The VDFN8 package's ATA650x CAN FD SBCs have a small footprint of 2 mm × 3 mm, the VDFN10 package's is 3 mm ×...
Sarcina Packaging Partner as sureCore Commercializes Cryogenic IP
Following the successful evaluation of test chips in both 180 nm and 22 nm process nodes, sureCore recently announced the launch of a range...
With Tenstorrent, BOS Semiconductors Pins Low-Power AI SoC for Automotive
Using intellectual property from US firm Tenstorrent, Korean company BOS Semiconductors created the first RISC-V AI accelerator chiplet named Eagle-N chiplet in the industry.
The...
Microchip New PolarFire FPGA, SoC Solution Stacks for Robotics, Medical Imaging
PolarFire® FPGA and SoC solution stacks for smart robotics and medical imaging have been introduced by Microchip Technology in response to the pressing issues...
Finding Sense in Google’s Bizarre Claims in its New Computing Chip, ‘Willow’!
Willow, Google's newest and touted as the finest quantum computing chip, was just released. Although Google's claims regarding the chip's speed and reliability were...
Producing 2nm Node Chips Isn’t Just About Scaling Components Down – IBM Research Veteran
Producing 2nm node chips isn’t just a matter of scaling components down, explained Dechao Guo, the director of advanced logic technology at IBM Research.
Modern...
Sondrel AI Accelerators Now Shipping under Turnkey Contract
Sondrel has declared that, as part of a complete turnkey contract of concept to silicon, it is currently sending completed chips to a customer...
How Silicon Labs FG23 SoC with Wirepas RF Mesh is Transforming India’s RDSS
Four million FG23 SoCs for smart energy meters have been shipped by Silicon Labs as part of India's Advanced Metering Infrastructure (AMI), the company...