At MWC 2025, R&S, VIAVI Showcase New Titan O-RU Analog Devices’ Energy Efficiency
In order to demonstrate the potential of network energy saving (NES) in open radio access networks (O-RAN), Analog Devices has partnered with Rohde &...
2.5D and 3D Hybrid Bonding Packaging: A Comprehensive Guide
Introduction to 2.5D and 3D Hybrid Bonding Packaging
As semiconductor technology continues to evolve, the need for advanced packaging solutions has become more pressing. Two...
Metis Engineering New Sensors Address Safety, Sustainability Challenges
Metis Engineering offers its range of configurable CAN-based environmental sensors; Cell Guard, H Guard, and Air Wise. Designed to address the crucial concerns of...
China Pushing Towards New RISC-V Policy – What it Means?
China is set to introduce a nationwide policy promoting RISC-V chip policy, a major step toward reducing reliance on Western semiconductor technologies.
The move aligns...
Infineon AURIX TC4Dx Bags Industry-Leading Product Compliance
In the field of vehicle cybersecurity, Infineon Technologies has accomplished a noteworthy milestone. The company's AURIX TC4Dx microcontroller was certified by ISO/SAE 21434.
The TÜV...
Programming on PicoScopes with SDK
About PicoScope SDK
SDK makes PicoScope go beyond just being a regular oscilloscope. Pico products come with a free-of-charge Software Development Kit (SDK). The SDK...
