Airspan Networks Strengthens Open RAN Leadership with Jabil Acquisition
Airspan Jabil Open RAN Acquisition to foster Open Radio Access Network (Open RAN) capabilities
Airspan Networks has announced the Airspan Jabil Open RAN acquisition will...
Zuchongzhi 3.0: China’s Quantum Giant Races Past Google’s Willow
China has taken a monumental step in quantum computing with the development of Zuchongzhi 3.0 quantum processor that outpaces Google’s Willow processor by a...
At MWC 2025, R&S, VIAVI Showcase New Titan O-RU Analog Devices’ Energy Efficiency
In order to demonstrate the potential of network energy saving (NES) in open radio access networks (O-RAN), Analog Devices has partnered with Rohde &...
2.5D and 3D Hybrid Bonding Packaging: A Comprehensive Guide
Introduction to 2.5D and 3D Hybrid Bonding Packaging
As semiconductor technology continues to evolve, the need for advanced packaging solutions has become more pressing. Two...
Metis Engineering New Sensors Address Safety, Sustainability Challenges
Metis Engineering offers its range of configurable CAN-based environmental sensors; Cell Guard, H Guard, and Air Wise. Designed to address the crucial concerns of...
China Pushing Towards New RISC-V Policy – What it Means?
China is set to introduce a nationwide policy promoting RISC-V chip policy, a major step toward reducing reliance on Western semiconductor technologies.
The move aligns...
