The 0.635 mm pitch AcceleRate mP connector series, a next-gen family of high-density, high-speed power and signal arrays built for the increasingly demanding needs of AI, HPC, and advanced datacom applications, is available at Powell Electronics.
The AcceleRate mP series has a compact, low-profile architecture with typical stack heights of 5 mm and 10 mm. It is designed for exceptional density and performance. The connectors completely meet PCIe® 6.0 and CXL™ 3.1 requirements and support up to 64 Gbps PAM4 (32 Gbps NRZ).
The use of rotated power blades, which greatly enhance thermal behavior while simplifying the breakout region, is a defining characteristic of the new series.
The system is perfect for dense, high-performance design contexts because of the open-pin-field layout, which further improves routing and grounding flexibility. Up to eight power and 240 signal positions are available in configurations.
Each connector has polarized guide posts to guarantee reliable blind mating and weld tabs for secure board-level attachment. For applications that need more accurate mating, optional alignment pins are also offered.
Key Comment
“The AcceleRate mP series represents a major step forward in high-density interconnect design,” comments Gary Evans, European Director at Powell Electronics. “As next-generation compute and networking architectures push the limits of power, speed, and space, this platform provides the performance and flexibility engineers need to move confidently into the next era of system design.”
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