In order to enhance safety and autonomy across all vehicle models, Texas Instruments (TI) launched new automotive semiconductors and development resources. The scalable TDA5 high-performance computing system-on-a-chips (SoCs) family from TI provides edge artificial intelligence (AI) that supports up to Society of Automotive Engineers Level 3 vehicle autonomy together with processing that is optimized for power and safety.
In order to assist engineers in streamlining high resolution radar systems, TI also introduced the AWR2188, a single-chip, eight-by-eight 4D imaging radar transceiver.
These devices are part of TI’s wider automotive portfolio for software-defined vehicles (SDVs) and next-generation advanced driver assistance systems (ADAS), coupled with the DP83TD555J-Q1 10BASE-T1S Ethernet physical layer (PHY).
These products will be introduced by TI at CES 2026, which will take place in Las Vegas, Nevada, from January 6–9.
High-performance compute SoCs enable safe, scalable AI across vehicle models
Automakers are employing central computing systems that support artificial intelligence (AI) and sensor fusion for real-time decision-making in order to boost safety and autonomy in next-generation vehicles.
TI’s TDA5 SoC family, built for high-performance computing, provides edge AI acceleration from 10 TOPS to 1200 TOPS with power efficiency beyond 24 TOPS/W. Their chiplet-ready design with Universal Chiplet Interconnect makes this scaling possible.
With Express interface technology, designers can employ a single portfolio to enable up to Level 3 autonomous driving and integrate various feature sets.
Building on more than 20 years of automotive processing expertise and existing portfolio, the family enhances the functionality of TI’s current portfolio to allow automakers to analyze advanced AI models and centralize their computing architectures.
TDA5 SoCs eliminate the need for costly thermal solutions by integrating the latest generation of TI’s C7 neural processing unit (NPU), which offers up to 12 times the AI computing of earlier generations with similar power consumption.
This performance increases in-vehicle intelligence while preserving cross-domain functionality by supporting billions of parameters within language models and transformer networks. The family’s most recent Arm Cortex-A720AE cores enable automakers to incorporate more computing, safety, and security applications.
To simplify complex vehicle software management, TI is partnering with Synopsys to provide a Virtualizer™ development kit for TDA5 SoCs. The kit’s digital twin capabilities help engineers accelerate time-to-market for their SDVs by up to 12 months.
Single-chip, eight-by-eight radar transceiver achieves earlier, more accurate detection
Radar is a fundamental technology of advanced ADAS and greater vehicle autonomy because to its enhanced perception and reliability in any weather conditions.
The AWR2188 4D imaging radar transceiver from TI combines eight transmitters and eight receivers into a single launch-on-package chip in order to meet the demands of the global market.
Because eight-by-eight configurations do not require cascade and scaling up to higher channel counts requires fewer devices, this integration simplifies higher-resolution radar systems.
The transceiver offers automakers the flexibility to streamline and expedite the worldwide rollout of ADAS capabilities across entry-level to premium vehicles by supporting both satellite and edge architectures.
The AWR2188 supports 30% faster performance than existing solutions because to its improved analog-to-digital converter data processing and radar chirp signal slope engine.
Advanced radar use cases including identifying objects in high-dynamic-range scenarios, finding lost cargo, and distinguishing between closely positioned vehicles are made possible by this degree of capability. Overall, safer, more autonomous driving is made possible by the transceiver’s increased precision in object detection at distances >350m.
10BASE-T1S technology extends Ethernet to vehicle edge nodes
The acceleration toward SDVs and higher levels of autonomy is prompting a fundamental shift in subsystem architectures. Ethernet is an important enabler for this evolution, as it allows systems to collect and transmit more data across vehicle zones in real time through a simple, unified network architecture.
TI’s new DP83TD555J-Q1 10BASE-T1S Ethernet Serial Peripheral Interface PHY with an integrated media access controller offers nanosecond time synchronization, industry-leading reliability and Power over Data Line capabilities.
These features enable engineers to extend high-performance Ethernet to vehicle edge nodes while reducing cable design complexity and costs.
With TI’s end-to-end system offering, which includes technologies for advanced sensing, reliable in-vehicle networking and efficient AI processing, automakers can develop systems that improve safety and automation levels across different vehicle models.
To learn more, read the company blog, “The semiconductor technology shaping the autonomous driving experience.”
Key Comment
“The automotive industry is moving toward a future where driving doesn’t require hands on the wheel,” said Mark Ng, director of automotive systems at TI. “Semiconductors are at the heart of bringing this vision of safer, smarter and more autonomous driving experiences to every vehicle. From detection and communication to decision-making, engineers can use TI’s end-to-end system offering to innovate what’s next in automotive.”
TI at CES 2026
In the Las Vegas Convention Center North Hall, meeting room No. N115, TI will showcase how innovation across its analog and embedded processing portfolios is reshaping what’s next in how people move, live and work.
TI at CES 2026 demonstrations include advancements in vehicle technology and advanced mobility, smart homes and digital health, energy infrastructure, robotics, and data centers. See ti.com/CES.
Package, Availability and Pricing
- The TDA54 software development kit is now available on TI.com to help engineers get started with the TDA54 Virtualizer development kit. Samples of the TDA54-Q1 SoC, the first device in the family, will be sampling to select automotive customers by the end of 2026.
- Preproduction quantities of the AWR2188 transceiver and an evaluation module are now available upon request at TI.com.
- Preproduction quantities of the DP83TD555J-Q1 10BASE-T1S Ethernet PHY and an evaluation module are now available upon request at TI.com.
To Know More: ti.com/TDA54-Q1 | ti.com/AWR2188 | ti.com/DP83TD555J-Q1.
