The new compact 12-slot LXI/USB modular chassis and its expanded ultra-high-density Series 125, said to be the industry’s smallest dual-pole reed relays, now joined by 1 Form B, 1 Form C, and 1 Form A RF variants, are just two of the products and services Pickering Group will display on stand 452 in Hall A1 at Productronica 2025, which will take place from November 18 to 21 at Messe München in Munich, Germany.
Pickering will also preview its new TSA (Test System Architecture) software platform at the show. Scheduled for release in early 2026, TSA is designed to help test engineers graphically design, share, maintain, and visualize their test system architecture.
Alongside the newly released products, Pickering will also showcase the following switching, simulation, and software products on stand 452 in Hall A1:
- A PXI-based BMS (battery management system) test demo, which combines multi-cell battery simulators with other switching and simulation modules to create a fully flexible HiL (hardware-in-the-loop) BMS test system.
- Turnkey LXI microwave switching and signal routing subsystems – including a custom 12×12 LXI microwave switching matrix demo.
- Various PXI/PXIe switching and simulation solutions – including the new MEMS-based MultiGBASE-T1 FIU (fault insertion unit), 5 amp battery simulator, high voltage programmable resistor and high speed resolver.
- Along its switching and simulation hardware, the company will also showcase its Switch Path Manager signal routing software, Microwave Switch Design Tool, and cabling and interconnection solutions – including its Cable Design Tool.
- In addition, Pickering Group’s reed relay division, Pickering Electronics, will highlight its latest reed relay ranges, including the recently released Series 600 customizable high voltage reed relays.
Productronica 2025, the world’s premier trade show for the electronics manufacturing industry, was founded in 1975 and is commemorating 50 years at the forefront of innovation.
Co-located with SEMICON Europa, it displays the full value chain spectrum of technologies and solutions for electronics development and production.
Every two years, the world of electronics production gathers in Munich to discuss everything from cleanroom technology and logistics to semiconductor manufacturing, microelectronics, and battery manufacture.
Leadership Comments
“Our modular switching and simulation products are based on familiar open industry standards that ensure long-term availability, shorten development time, and ultimately accelerate time-to-market,” said Steven Edwards, Head of Product Management at Pickering. “With expert-level knowledge in architecting switching and simulation systems, we help our customers achieve their test objectives efficiently and deliver products with intuitive tools to enhance development teams’ design efforts and productivity. The result is scalable COTS test systems that can be optimized to meet their needs today and in the future.”
Previewing the new 12-slot LXI/USB modular chassis, Lee Huckle, Chassis Product Manager at Pickering Interfaces, added: “Featuring a hybrid PXI/PXIe backplane and controllable by Ethernet or USB, the chassis occupies only a 2U rack-height form factor – making it ideal for space-restricted applications. Offering the highest slot count available in a 2U chassis and the lowest cost per slot on the market, it addresses a real need in the test and measurement space for more compact, scalable, and affordable modular test platforms.”
“With more than 55 years’ experience of designing high quality reed relays for use in instrumentation and automated test equipment (ATE), our relays are recognised for being highly reliable due to superior manufacturing and quality control processes,” said Robert King, Reed Relays Product Manager at Pickering Electronics. Previewing the expanded variants of its Series 125 ultra-high-density reed relays, King added: “Our updated Series 125 retains the world’s smallest 2-pole footprint and now adds the smallest 1A RF, 1B, and 1C options, enabling record channel density and greater routing flexibility on space-constrained cards.”
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